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Over the years, the DRAM latency has not scaled proportionally with its density due to the cost-centric mindset of the DRAM industry. Prior work has shown that this shortcoming can be overcome by reducing the critical length of DRAM access…
Monolithic 3D (M3D) technology enables high density integration, performance, and energy-efficiency by sequentially stacking tiers on top of each other. M3D-based network-on-chip (NoC) architectures can exploit these benefits by adopting…
To continue scaling beyond 2-D CMOS with 3-D integration, any new 3-D IC technology has to be comparable or better than 2-D CMOS in terms of scalability, enhanced functionality, density, power, performance, cost, and reliability.…
Duplication-based redundancy schemes have proven to be effective in designing fully-resilient Quasi-delay Insensitive (QDI) asynchronous circuits. The complete resiliency, however, is accompanied by significant energy, latency, and area…
Monolithic three-dimensional integration of memory and logic circuits could dramatically improve performance and energy efficiency of computing systems. Some conventional and emerging memories are suitable for vertical integration,…
This work presents a novel monolithic 3D (M3D) FPGA architecture that leverages stackable back-end-of-line (BEOL) transistors to implement configuration memory and pass gates, significantly improving area, latency, and power efficiency. By…
Monolithic Three-Dimensional Integrated Circuits (M3D-IC) has become an attractive option to increase the transistor density. In M3D-IC, substrate layers are realized on top of previous layers using sequential integration techniques. Recent…
Monolithic 3D integration has become a promising solution for future computing needs. The metal inter-layer via (MIV) forms interconnects between substrate layers in Monolithic 3D integration. Despite small size of MIV, the area overhead…
Parallel and monolithic 3D integration directions offer pathways to realize 3D integrated circuits (ICs) but still lead to layer-by-layer implementations, each functional layer being composed in 2D first. This mindset causes challenging…
Modern integrated circuits are essentially two-dimensional (2D). Partial three-dimensional (3D) integration and 3D-transistor-level integrated circuits have long been anticipated as routes to improve the performance, cost and size of…
Three-dimensional (3D) photonic integration offers a pathway to overcome the fundamental scaling limitations of planar platforms by enabling enhanced routing flexibility for compact, low-loss, and highly interconnected photonic circuits. In…
Systolic arrays are popular for executing deep neural networks (DNNs) at the edge. Low latency and energy efficiency are key requirements in edge devices such as drones and autonomous vehicles. Monolithic 3D (MONO3D) is an emerging 3D…
Recent nano-technological advances enable the Monolithic 3D (M3D) integration of multiple memory and logic layers in a single chip, allowing for fine-grained connections between layers and significantly alleviating main memory bottlenecks.…
The demand for the three-dimensional (3D) integration of electronic components is on a steady rise. The through-silicon-via (TSV) technique emerges as the only viable method for integrating single-crystalline device components in a 3D…
In this work we explore monolithic opto-electronic integration platform for significant down-scaling of input-referred noise in custom designed low-noise analog front-end used for balanced photodetection. The performance of such…
Hybrid circuit quantum electrodynamics (cQED) aims at coupling various quantum degrees of freedom, among which are spin and charge degrees of freedom in gate defined quantum dots, phonons or magnons... with quantized electromagnetic fields…
Three-dimensional integrated circuits promise power, performance, and footprint gains compared to their 2D counterparts, thanks to drastic reductions in the interconnects' length through their smaller form factor. We can leverage the…
Conventional 2D CMOS technology is reaching fundamental scaling limits, and interconnect bottleneck is dominating integrated circuit (IC) power and performance. While 3D IC technologies using Through Silicon Via or Monolithic Inter-layer…
Silicon photonic integration has gained great success in many application fields owing to the excellent optical device properties and complementary metal-oxide semiconductor (CMOS) compatibility. Realizing monolithic integration of III-V…
Multifunctional three-dimensional (3-D) nano-architectures, integrating all device components within tens of nanometers, offer great promise for next generation electrical energy storage applications, but have remained challenging to…