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Sequence alignment is a fundamental process in computational biology which identifies regions of similarity in biological sequences. With the exponential growth in the volume of data in bioinformatics databases, the time, processing power,…
For the past four decades, cost and features have driven CMOS scaling. Severe lithography and material limitations seen below the 20 nm node, however, are challenging the fundamental premise of affordable CMOS scaling. Just continuing to…
Bit-level sparsity methods skip ineffectual zero-bit operations and are typically applicable within bit-serial deep learning accelerators. This type of sparsity at the bit-level is especially interesting because it is both orthogonal and…
The continuous technological development of electronic devices and the introduction of new materials leads to ever greater demands on the fabrication of semiconductor heterostructures and their characterization. This work focuses on…
Radar has become an essential sensor for autonomous navigation, especially in challenging environments where camera and LiDAR sensors fail. 4D single-chip millimeter-wave radar systems, in particular, have drawn increasing attention thanks…
Most previous 3D IC research focused on stacking traditional 2D silicon layers, so the interconnect reduction is limited to inter-block delays. In this paper, we propose techniques that enable efficient exploration of the 3D design space…
Cosmological simulations require the use of a multiple time-stepping scheme. Without such a scheme, cosmological simulations would be impossible due to their high level of dynamic range; over eleven orders of magnitude in density. Such a…
Due to the very rapidly growing use of Artificial Neural Networks (ANNs) in real-world applications related to machine learning and Artificial Intelligence (AI), several hardware accelerator de-signs for ANNs have been proposed recently. In…
Architected materials achieve unique mechanical properties through precisely engineered microstructures that minimize material usage. However, a key challenge of low-density materials is balancing high stiffness with stable deformability up…
Inspired by the challenge of scaling up existing silicon quantum hardware, we investigate compilation strategies for sparsely-connected 2d qubit arrangements and propose a spin-qubit architecture with minimal compilation overhead. Our…
Developing ultra-low-energy superconducting computing and fault-tolerant quantum computing will require scalable superconducting memory. While conventional superconducting logic-based memory cells have facilitated early demonstrations,…
Crystalline two-dimensional (2D) semiconductors often combine high elasticity and in-plane strength, making them ideal for strain-induced tuning of electronic characteristics, akin to strategies used in silicon electronics. However,…
Advances in hybrid bonding and packaging have driven growing interest in 3D DRAM-stacked accelerators with higher memory bandwidth and capacity. As LLMs scale to hundreds of billions or trillions of parameters, distributed inference across…
While GPUs dominate massively parallel computing through the single-instruction, multiple-thread (SIMT) programming model, their underlying single-instruction, multiple-data (SIMD) execution incurs substantial energy overhead from frequent…
3D die-stacked DRAM has emerged as a key technology for delivering high bandwidth and high density for applications such as high-performance computing, graphics, and machine learning. However, different applications place diverse and…
We report here an atomic resolution study of the structure and composition of the grain boundaries in polycrystalline Sr0.6K0.4Fe2As2 superconductor. A large fraction of grain boundaries contain amorphous layers larger than the coherence…
Memristor is a promising building block for the next generation nonvolatile random access memory and bio-inspired computing systems. Organizing memristors into high density crossbar arrays, although challenging, is critical to meet the…
Albeit being a prevalent architecture searching approach, differentiable architecture search (DARTS) is largely hindered by its substantial memory cost since the entire supernet resides in the memory. This is where the single-path DARTS…
In 3D printing, stiff fibers (e.g., carbon fiber) can reinforce thermoplastic polymers with limited stiffness. However, existing commercial digital manufacturing software only provides a few simple fiber layout algorithms, which solely use…
Power flow feasibility assessment is computationally challenging for unbalanced three-phase distribution networks. This paper develops a vectorized semidefinite program (SDP) based on the bus injection model (BIM) and reformulates its dual…