Related papers: System-Technology Co-Optimization of Bitline Routi…
We present a guide for the design and fabrication of a CMOS-compatible metamaterial microstructure as an absorber of visible light with exceptionally high absorption efficiency (~ 98%), for wavelengths 400nm-700nm. The structural parameters…
Diffusion Transformer (DiT) has emerged as a powerful model architecture for generating high-quality images and videos. In the case of video DiT, 3D Spatio-Temporal Attention increases token length in proportion to the number of frames,…
The advancement of large language models has led to models with billions of parameters, significantly increasing memory and compute demands. Serving such models on conventional hardware is challenging due to limited DRAM capacity and high…
Silicene monolayers grown on Ag(111) surfaces demonstrate a band gap that is tunable by oxygen adatoms from semimetallic to semiconducting type. By using low-temperature scanning tunneling microscopy, it is found that the adsorption…
This work explores the cross-node scaling potential of SOT-MRAM for last-level caches (LLCs) under heterogeneous system scaling paradigm. We perform extensive Design-Technology Co-Optimization (DTCO) exercises to evaluate the bitcell…
Future complementary metal oxide semiconductor (CMOS) scaling for advanced integrated circuit (IC) technologies may well depend on "More than Moore" (MtM) approaches using heterogeneous integration of semiconductor-based devices. In order…
Modern computing workloads demand energy-efficient, high-bandwidth interconnects, motivating photonic interposers as an alternative to electrical links. Here we demonstrate a compact 3D silicon nitride (SiN) photonic interposer prototype…
Distributed deep learning (DDL) systems strongly depend on network performance. Current electronic packet switched (EPS) network architectures and technologies suffer from variable diameter topologies, low-bisection bandwidth and…
Nanoscale transistors require aggressive reduction of all channel dimensions: length, width, and thickness. While monolayer two-dimensional semiconductors (2DS) offer ultimate thickness scaling, good performance has largely been achieved…
This paper addresses cooperative link scheduling problems for base station (BS) aided device-to-device (D2D) communications using limited channel state information (CSI) at BS. We first derive the analytical form of ergodic sum-spectral…
A consistent and widely accepted physical basis for interpretation of charge transport in amorphous oxide semiconductor (AOS) field-effect transistors (FETs), and more generally device physics, has been hampered by uncertainties in…
In this paper, a novel robust beamforming scheme is proposed in three dimensional multi-input multi-output (3D-MIMO) systems. As one of the typical deployments of massive MIMO, a 3D-MIMO system owns sparse channels in angular domain. Thus,…
The development of compact, energy-efficient integrated lasers operating at 1.3 um remains a critical focus in silicon photonics, essential for advancing data communications and optical interconnect technologies. This paper presents a…
Modern deployment often requires trading accuracy for efficiency under tight CPU and memory constraints, yet common compression proxies such as parameter count or FLOPs do not reliably predict wall-clock inference time. In particular,…
Oxide interfaces provide an opportunity for electronics. However, patterning of electron gases at complex oxide interfaces is challenging. In particular, patterning of complex oxides while preserving a high electron mobility remains…
Increasing storage density exacerbates DRAM read disturbance, a circuit-level vulnerability exploited by system-level attacks. Unfortunately, existing defenses are either ineffective or prohibitively expensive. Efficient mitigation is…
Machine learning and artificial intelligence algorithms typically require large amount of data for training. This means that for nonlinear aeroelastic applications, where small training budgets are driven by the high computational burden…
Parallel and monolithic 3D integration directions offer pathways to realize 3D integrated circuits (ICs) but still lead to layer-by-layer implementations, each functional layer being composed in 2D first. This mindset causes challenging…
Ultra-thin-body (UTB) channel materials of a few nanometers in thickness are currently considered as candidates for future electronic, thermoelectric, and optoelectronic applications. Among the features that they possess, which make them…
Stacked intelligent metasurface (SIM) is an emerging design that consists of multiple layers of metasurfaces. A SIM enables holographic multiple-input multiple-output (HMIMO) precoding in the wave domain, which results in the reduction of…