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A novel gaseous two-dimensional imaging detector "Micro Pixel Chamber (micro-PIC)" has been developed. This detector is based on double sided printed circuit board (PCB). We have developed large area (10cm x 10cm) micro-PICs with 65536…
The TT-PET collaboration is developing a PET scanner for small animals with 30 ps time-of-flight resolution and sub-millimetre 3D detection granularity. The sensitive element of the scanner is a monolithic silicon pixel detector based on…
The Electron-Ion Collider (EIC) is a next-generation particle accelerator facility designed to probe the fundamental structure of matter such as the origins of nucleon mass, spin, and the dynamic behavior of quarks and gluons within nucleon…
One of the possible ways to maintain the micrometer spatial resolution while performing ion beam analysis in the air is to increase the energy of ions. In order to explore capabilities and limitations of this approach, we have tested a…
Test beam results obtained with 3D pixel sensors bump-bonded to the RD53A prototype readout ASIC are reported. Sensors from FBK (Italy) and IMB-CNM (Spain) have been tested before and after proton-irradiation to an equivalent fluence of…
Highly integrated multichannel readout electronics is crucial in contemporary particle physics experiments. A novel silicon photomultiplier readout system based on the VMM3a ASIC was developed, for the first time exploiting this chip for…
Hybrid pixel sensor technology such as the Medipix3 represents a unique tool for electron imaging. We have investigated its performance as a direct imaging detector using a Transmission Electron Microscope (TEM) which incorporated a…
The performance of the electromagnetic calorimeter of the ALICE experiment during operation in 2010-2018 at the Large Hadron Collider is presented. After a short introduction into the design, readout, and trigger capabilities of the…
The TT-PET collaboration is developing a small animal TOF-PET scanner based on monolithic silicon pixel sensors in SiGe BiCMOS technology. The demonstrator chip, a small-scale version of the final detector ASIC, consists of a 3 x 10 pixel…
Collider detectors have taken advantage of the resolution and accuracy of silicon detectors for at least four decades. Future colliders will need large areas of silicon sensors for low mass trackers and sampling calorimetry. Monolithic…
The development of detectors that provide high resolution in four dimensions has attracted wide-spread interest in the scientific community for several applications in high-energy physics, nuclear physics, medical imaging, mass spectroscopy…
In order to achieve the challenging requirements on the CLIC vertex detector, a range of technology options have been considered in recent years. One prominent idea is the use of active sensors implemented in a commercial high-voltage CMOS…
The electromagnetic calorimeter (ECAL) is a key detector component for precise electron and photon measurements in electron-ion collision experiments. At the Electron-Ion Collider in China (EicC), high-performance calorimetry is essential…
MiniCACTUS-v2 is a monolithic sensor prototype designed in LF 150 nm CMOS process for time tagging of individual Minimum Ionizing Particles with an accuracy better than 100 ps. The sensing element is a deep n-well/p-substrate diode without…
The EIC will deliver collisions of electrons with protons and nuclei at a wide variety of energies and at luminosities up to 1000 times higher than HERA. Precise measurement of both the scattered electron and the hadronic final state is…
The next generation experiment in high energy particle physics will be International Linear Collider of electron and positron at the TeV scale. The experiment is aim to search the Higgs particle and to measure its properties. The physics…
The Circular Electron-Positron Collider (CEPC), as the next-generation electron-positron collider, is tasked with advancing not only Higgs physics but also the discovery of new physics. Achieving these goals requires high-precision…
Active Pixel Sensor (APS) technology has shown promise for next-generation vertex detectors. This paper discusses the design and testing of two generations of APS chips. Both are arrays of 128 by 128 pixels, each 20 by 20 micro-m. Each…
Analogue test structures were fabricated using the Tower Partners Semiconductor Co. CMOS 65 nm ISC process. The purpose was to characterise and qualify this process and to optimise the sensor for the next generation of Monolithic Active…
In ion cancer therapy, high-intensity ion beams are used to treat tumors by taking advantage of the Bragg-Peak. Typical ion therapy centers use particle rates up to $10^{10}$ ions/second for treatment. On the other hand, such intensities…