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We present a compact current sensor based on a superconducting microwave lumped-element resonator with a nanowire kinetic inductor, operating at 4.2 K. The sensor is suitable for multiplexed readout in GHz range of large-format arrays of…

Instrumentation and Detectors · Physics 2017-09-11 S. Doerner , A. Kuzmin , K. Graf , S. Wuensch , I. Charaev , M. Siegel

An overview on recent developments in thermal interfaces is given with a focus on a novel thermal interface technology that allows the formation of 2-3 times thinner bondlines with strongly improved thermal properties at lower assembly…

General Physics · Physics 2008-01-08 R. Linderman , T. Brunschwiler , B. Smith , B. Michel

A novel concept for position-sensitive thermal neutron detectors based on thin-gap Resistive Plate Chambers (RPC) lined with a neutron converter layer is presented and its feasibility is discussed. Several detector architectures…

Instrumentation and Detectors · Physics 2018-08-29 L. M. S. Margato , A. Morozov

Carrier injection into carbon nanotubes and graphene nanoribbons, contacted by a metal coating over an arbitrary length, is studied by various means: Minimal models allow for exact analytic solutions which can be transferred to the original…

Mesoscale and Nanoscale Physics · Physics 2008-04-30 Norbert Nemec , David Tomanek , Gianaurelio Cuniberti

This paper analyzes a transient method for the characterization of low-resistance thermal interfaces of microelectronic packages. The transient method can yield additional information about the package not available with traditional static…

General Physics · Physics 2008-01-08 B. Smith , T. Brunschwiler , B. Michel

For many decades High Energy Physics (HEP) instrumentation has been concentrated on detectors of ionizing radiation -- where the energy of incident particles or photons is sufficient to create mobile charge in gas, liquid, or solid…

Instrumentation and Detectors · Physics 2022-04-06 Josef Frisch , Paul O'Connor

A thermal position sensor was fabricated and evaluated. The device consists of an array of temperature sensing elements, fabricated entirely on a plastic substrate. A novel fabrication technology was implemented which allows direct…

General Physics · Physics 2008-01-08 A. Petropoulos , G. Kaltsas , D. Goustouridis , A. G. Nassiopoulou

Superconducting detectors are now well-established tools for low-light optics, and in particular quantum optics, boasting high-efficiency, fast response and low noise. Similarly, lithium niobate is an important platform for integrated…

This article deals with the prediction of thermomechanical properties of fiber reinforced composites using several micromechanics models. These include strength of material approach, Halpin-Tsai equations, multi-phase mechanics of materials…

Applied Physics · Physics 2017-08-03 S. I. Kundalwal

The nanoparticle packed bed (NPB) as a kind of promising thermal insulation materials has drawn widely concern because of their quite low thermal conductivities (k). In this paper, based on the concept that NPB morphology enable low k, we…

Applied Physics · Physics 2020-01-15 Zizhen Lin , Congliang Huang

Developing compact, low-dissipation, cryogenic-compatible microwave electronics is essential for scaling up low-temperature quantum computing systems. In this paper, we demonstrate an ultra-compact microwave directional forward coupler…

Resistive Plate Chamber detectors are largely used in current High Energy Physics experiments, typically operated in avalanche mode with large fractions of Tetrafluoroethane (C2H2F4), a gas recently banned by the European Union due to its…

Instrumentation and Detectors · Physics 2024-10-16 Luca Quaglia

Integrating a thermopile with a low power operational amplifier is an effective and cost-efficient approach to obtain a high performance compact Terahertz power detector. Here we present the development of such an integrated detector,…

Instrumentation and Detectors · Physics 2012-04-27 F. Voltolina , U. Dillner , E. Kessler , P. Haring Bolivar

This paper investigates the use of carbon nanotube field effect transistors (CNFETs) for the design of ternary full adder cells. The proposed circuits have been designed based on the unique properties of CNFETs such as having desired…

Emerging Technologies · Computer Science 2017-01-03 Fazel Sharifi , Atiyeh Panahi , Mohammad Hossein Moaiyeri , Keivan Navi

Molecular communication (MC) enables biocompatible and energy-efficient information transfer through chemical signaling, forming a foundational paradigm for emerging applications in the Internet of Nano Things (IoNT) and intrabody…

Signal Processing · Electrical Eng. & Systems 2025-10-30 Dilara Aktas , Ozgur B. Akan

Hybrid battery thermal management systems (HBTMS) combining active liquid cooling and passive phase change materials (PCM) cooling have shown a potential for the thermal management of lithium-ion batteries. However, the fill volume of…

Systems and Control · Electrical Eng. & Systems 2024-12-03 Zhipeng Lyu , Jinrong Su , Zhe Li , Xiang Li , Hanghang Yan , Lei Chen

Integration of superconducting nanowire single photon detectors and quantum sources with photonic waveguides is crucial for realizing advanced quantum integrated circuits. However, scalability is hindered by stringent requirements on high…

The development of high-performing sensing materials, able to detect ppb-trace concentrations of volatile organic compounds at low temperatures, is required for the development of next-generation miniaturized wireless sensors. Here, we…

The ability to tune the thermal resistance of carbon nanotube mechanical supports from insulating to conducting could permit the next generation of thermal management devices. Here, we demonstrate fabrication techniques for carbon nanotube…

Mesoscale and Nanoscale Physics · Physics 2015-05-19 Kamal H. Baloch , Norvik Voskanian , John Cumings

An original packaging method suitable for integrated thermal mass flow sensors is presented. The method consists in the application of a plastic transparent adapter to the chip surface. The adapter is sealed to the chip surface by means of…

Other Computer Science · Computer Science 2008-02-22 P. Bruschi , V. Nurra