An original packaging method suitable for integrated thermal mass flow sensors is presented. The method consists in the application of a plastic transparent adapter to the chip surface. The adapter is sealed to the chip surface by means of a thermal procedure. By this approach it is possible to selectively convey the fluid flow to reduced chip areas, avoiding contact with the pads. Fabrication and testing of a very compact flow sensor is described.
@article{arxiv.0802.3062,
title = {An Integrated Circuit Compatible Compact Package for Thermal Gas Flowmeters},
author = {P. Bruschi and V. Nurra},
journal= {arXiv preprint arXiv:0802.3062},
year = {2008}
}
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