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The MALTA CMOS monolithic silicon pixel sensors has been developed in the Tower 180 nm CMOS imaging process. It includes an asynchronous readout scheme and complies with the ATLAS inner tracker requirements for the HL-LHC. Several 4-chip…

In this work, we design and characterize a 4-pixel superconducting hot-electron bolometer (HEB) based on niobium nitride (NbN), integrated with individual planar silicon nitride (Si$_3$N$_4$) waveguides. The implemented architecture enables…

Infrared (IR) radiation detectors are used in numerous applications from thermal imaging to spectroscopic gas sensing. Obtaining high speed and sensitivity, low-power operation and cost-effectiveness with a single technology remains to be a…

The authors report on synthesis and thermal properties of the electrically-conductive thermal interface materials with the hybrid graphene-metal particle fillers. The thermal conductivity of resulting composites was increased by ~500% in a…

At millimeter dimension or less, the conventional bonding technology in electronic assembly relies heavily on reflow soldering and suffers from severe performance and reliability degradation. Meanwhile, the traditional high temperature…

Materials for electronics that function as electrical and/or thermal conductors are often rigid, expensive, difficult to be sourced and sometimes toxic. An electrically and thermally conductive nanocomposite that is lightweight, flexible…

Controlling thermal transport is important for a range of devices and technologies, from phase change memories to next-generation electronics. This is especially true in nano-scale devices where thermal transport is altered by the influence…

The miniaturization of diagnostic devices that exploit optical detection schemes requires the design of light-sources combining small size, high performance for effective excitation of chromophores, and mechanical flexibility for easy…

We are investigating the use of low temperature wafer-wafer bonding in the fabrication of next-generation particle pixel detectors. This bonding technique could enable the integration of fully processed CMOS readout wafers with high-Z…

Improving lithium-ion batteries (LIBs) safety remains in a challenging task when compared with the tremendous progress made in their performance in recent years. Embedding thermo-responsive polymer switching materials (TRPS) into LIB cells…

In recent years, the progress on low temperature detector technologies has allowed design of large scale experiments aiming at pushing down the sensitivity on the neutrino mass below 1\,eV. Even with outstanding performances in both energy…

We are developing Nb diffusion-cooled Hot Electron Bolometers (HEBs) for a large-format array submillimeter camera. We have fabricated Nb HEBs using a new angle deposition process. We have characterized these devices using heterodyne mixing…

We present a comprehensive analysis and experimental study of THz hot-electron bolometer (HEB) mixers made from 40-nm-thick sputtered magnesium diboride (MgB2) thin films on high-resistivity silicon substrates. Using a lumped-element…

This article reviews the state of rapidly emerging terahertz hot-electron nanobolometers (nano-HEB), which are currently among of the most sensitive radiation power detectors at submillimeter wavelengths. With the achieved noise equivalent…

The HASPIDE (Hydrogenated Amorphous Silicon PIxels DEtectors) project aims at the development of thin hydrogenated amorphous silicon (a-Si:H) detectors on flexible substrates (mostly Polyimide) for beam monitoring, neutron detection and…

Scanning thermal microscopy (SThM) - a type of scanning probe microscopy that allows mapping thermal transport and temperatures in nanoscale devices, is becoming a key approach that may help to resolve heat dissipation problems in modern…

A scalable excitation platform for nanophotonic emitters using individually addressable micro-LED-on-CMOS arrays is demonstrated for the first time. Heterogeneous integration by transfer-printing of semiconductor nanowires was used for the…

We review the current state of the art of graphene-enhanced thermal interface materials for the management of heat the next generation of electronics. Increased integration densities, speed, and power of electronic and optoelectronic…

Recent advances in the synthesis of inorganic and organic nanowires and nanotubes have provided both components for various functional devices and platforms for the study of low- dimensional transport phenomena. However, tremendous…

Wafer-level testing is an important step for process and quality control of electronic chips in integrated circuit (IC) manufacturing which occurs before packaging. The process of wafer probing in its conventional contacting schemes,…