Related papers: Simultaneous power generation and cooling using se…
The transverse thermoelectric generation and cooling performances in a thermopile module composed of recently developed SmCo$_5$/Bi$_{0.2}$Sb$_{1.8}$Te$_3$ artificially tilted multilayers are evaluated quantitatively. When a large…
Cooling high-power electronics in multilayer integrated circuits (ICs) is challenging for existing cooling methods. In this work, we designed through-chip microchannels (TCMCs) that cross the entire chip perpendicularly to the layers, with…
To extend the applicability of density functional theory for superconductors (SCDFT) to systems with significant particle-hole asymmetry, we construct a new exchange-correlation kernel entering the gap equation. We show that the kernel is…
An unconventional method of continuous solid-state cryogenic cooling utilizing the electron subband degeneracy of semiconductor heterostructures is proposed in this Letter. An electrostatic heat pump is modeled, which employs subband…
Lithium-ion batteries are widely used in electric vehicles and grid energy storage systems. Compared to cylindrical batteries, prismatic cells are the primary choice because of their advantage for dense packing. However, thermal runaway and…
Environmentally-powered computer systems operate on renewable energy harvested from their environment, such as solar or wind, and stored in batteries. While harvesting environmental energy has long been necessary for small-scale embedded…
The negative differential thermal conductance (NDTC) provides the key mechanism for realizing thermal transistors. This exotic effect has been the object of an extensive theoretical investigation, but the implementation is still limited to…
Herein, we report the use of nanostructured crystalline Si as a thermoelectric material and its integration into thermoelectric harvesters. The proof-of-concept relies on the partial suppression of lattice thermal transport by introducing…
We discuss the theory of cooling electrons in solid-state devices via ``evaporative emission.'' Our model is based on filtering electron subbands in a quantum-wire device. When incident electrons in a higher-energy subband scatter out of…
Efficient heat dissipation to the substrate is crucial for optimal device performance in nanoelectronics. We develop a theory of electronic thermal boundary conductance (TBC) mediated by remote phonon scattering for the single-layer…
During recent years, microelectronics helped to develop complex and varied technologies. It appears that many of these technologies can be applied successfully to realize Seebeck micro generators: photolithography and deposition methods…
Adding thermal conductivity enhancements to increase thermal power in solid-liquid phase-change thermal energy storage modules compromises volumetric energy density and often times reduces the mass and volume of active phase change material…
This paper introduces the concept of Transient Slack Capability (TSC), a set of three necessary device-level conditions to ensure stability under sustained power perturbations. TSC states that a device must (1) possess sufficient stored…
Overheating has emerged as a primary challenge constraining the reliability and performance of next-generation high-performance electronics, such as chiplets and (ultra)wide bandgap electronics. Advanced heterogeneous integration not only…
Enhanced electron cooling is demonstrated in a strained-silicon/superconductor tunnel junction refrigerator of volume 40 um^3. The electron temperature is reduced from 300 mK to 174 mK, with the enhancement over an unstrained silicon…
Simultaneously concentrating EM waves and heat fluxes to the same target region within an on-chip system carries substantial academic research importance and practical application value. Nevertheless, existing researches are primarily aimed…
Developing thermal analogues of field-effect transistor could open the door to a low-power and even zero-power communication technology working with heat rather than electricity. These solid-sate devices could also find many applications in…
In this paper we present a simple and efficient built-in temperature sensor for thermal monitoring of standard-cell based VLSI circuits. The proposed smart temperature sensor uses a ring-oscillator composed of complex gates instead of…
For modern Gas sensors, high sensitivity and low power are expected. This paper discusses design, simulation and fabrication of new Micromachined Thermal Converters (MTCs) based on GaAs developed for Gas sensors. Metal oxide gas sensors…
Thermal FEM (Finite Element Method) simulations can be used to predict the thermal behavior of power semiconductors in application. Most power semiconductors are made of silicon. Silicon thermal material properties are significantly…