Related papers: Thermal Analysis of 3D GPU-Memory Architectures wi…

Unlike the electrical conductance that can be widely modulated within the same material even in deep nanoscale devices, tuning the thermal conductance within a single material system or nanostructure is extremely challenging and requires a…

For beyond 2-D CMOS logic, various 3-D integration approaches specially transistor based 3-D integrations such as monolithic 3-D [1], Skybridge [2], SN3D [3] holds most promise. However, such 3D architectures within small form factor…

Processing-in-Memory (PIM) architectures offer promising solutions for efficiently handling AI applications in energy-constrained edge environments. While traditional PIM designs enhance performance and energy efficiency by reducing data…

Heat transfer in nanocomposite materials has attracted great interest for various applications. Multilayer structures provide an important platform to study interfacial thermal transport and to engineer materials with ultralow thermal…

Gallium oxide (Ga$_2$O$_3$) has attracted significant interest for its unique potential especially in power electronics. However, its low and anisotropic thermal conductivity poses a major challenge for heat dissipation. Here, we explore an…

Two-dimensional material-based memristors have recently gained attention as components of future neuromorphic computing concepts. However, their surrounding atmosphere can influence their behavior. In this work, we investigate the resistive…

Hyperbolic superlattices are used for sub-wavelength focusing, cloaking, and optical thermal management. Typically, these superlattices are constructed of layers of noble metals and insulators. Despite these systems displaying excellent…

Fine-grained power estimation in multicore Systems on Chips (SoCs) is crucial for efficient thermal management. BPI (Blind Power Identification) is a recent approach that determines the power consumption of different cores and the thermal…

Hexagonal boron nitride (hBN) and black phosphorus (bP) are crystalline materials that can be seen as ordered stackings of two-dimensional layers, which lead to outstanding anisotropic physical properties. The knowledge of the thermal…

Galliumnitride has become a strategic superior material for space, defense and civil applications, primarily for power amplification at RF and mm-wave frequencies. For AlGaN/GaN high electron mobility transistors (HEMT), an outstanding…

Chemical and structural diversity present in hexagonal boron nitride ((h-BN) and graphene hybrid nanostructures provide new avenues for tuning various properties for their technological applications. In this paper we investigate the…

This study investigates the thermal expansion coefficient of two-dimensional (2D) functionalized boron nitride (f-BN) materials using first-principles density functional theory (DFT). Two-dimensional materials, particularly hexagonal boron…

The AI datacenters are currently being deployed on a large scale to support the training and deployment of power-intensive large-language models (LLMs). Extensive amount of computation and cooling required in datacenters increase concerns…

To resolve the rising temperatures in 3.5D-ICs, a thermal-aware design flow becomes increasingly crucial, necessitating an accurate and efficient thermal simulation tool. However, previous tools struggle to handle the unique heterogeneous…

Hexagonal boron nitride (h-BN) is a two dimensional (2D) layered insulator with superior dielectric performance that offers excellent interaction with other 2D materials (e.g. graphene, MoS2). Large-area h-BN can be readily grown on…

Feedback from the active galactic nuclei (AGN) is one of the most promising heating mechanisms to circumvent the cooling-flow problem in galaxy clusters. However, the role of thermal conduction remains unclear. Previous studies have shown…

Thick metamorphic buffers are perceived to be indispensable for the heteroepitaxial integration of III-V semiconductors on silicon substrates with large thermal expansion and lattice mismatches. However, III-nitride buffers in conventional…

The two-dimensional atomically thin insulator hexagonal boron nitride (h-BN) constitutes a new paradigm in tunnel based devices. A large band gap along with its atomically flat nature without dangling bonds or interface trap states makes it…

The highly anisotropic thermal conductivity in layered materials is crucial for a broad range of applications such as thermal management of electronic devices, thermal insulation, and thermoelectrics. Understanding of anisotropic thermal…

Thermal behavior has become a first-order constraint in advanced 2.5D/3D integrated circuits (ICs) and heterogeneous packages. As power densities rise and multiple active dies are vertically integrated, heat removal paths become…