Related papers: CMOS 2.0 -- Redefining the Future of Scaling

Computer modeling is essential to research on Advanced Accelerator Concepts (AAC), as well as to their design and operation. This paper summarizes the current status and future needs of AAC systems and reports on several key aspects of (i)…

Micromechanical devices like accelerometers or rotation sensors form an increasing segment beneath the devices supplying the consumer market. A hybrid integration approach to build smart sensor clusters for the precise detection of…

Any architecture for practical quantum computing must be scalable. An attractive approach is to create multiple cores, computing regions of fixed size that are well-spaced but interlinked with communication channels. This exploded…

To address the limited wave domain signal processing capabilities of traditional single-polarized stacked intelligent metasurfaces (SIMs) in holographic multiple-input multiple-output (HMIMO) systems, which stems from limited integration…

Reconstructing 3D representations from 2D inputs is a fundamental task in computer vision and graphics, serving as a cornerstone for understanding and interacting with the physical world. While traditional methods achieve high fidelity,…

In this paper, we provide a system level perspective on the design of control electronics for large scale quantum systems. Quantum computing systems with high-fidelity control and readout, coherent coupling, calibrated gates, and…

Heterogeneous 3D System-on-Chips (3D SoCs) are the most promising design paradigm to combine sensing and computing within a single chip. A special characteristic of communication networks in heterogeneous 3D SoCs is the varying latency and…

Conventional digital beamforming for wideband multiuser orthogonal frequency-division multiplexing (OFDM) demands numerous power-hungry components, increasing hardware costs and complexity. By contrast, the stacked intelligent metasurfaces…

Contemporary software systems, such as the Internet of Things, Industry 4.0 and Intelligent Cities, present challenges for their engineering, since they question our traditional form of software development. They represent a promising…

Over the past two decades, 2D materials have rapidly evolved into a diverse and expanding family of material platforms. Many members of this materials class have demonstrated their potential to deliver transformative impact on fundamental…

High-speed signal processing is essential for maximizing data throughput in emerging communication applications, like multiple-input multiple-output (MIMO) systems and radio-frequency (RF) interference cancellation. However, as these…

Modern integrated circuits are essentially two-dimensional (2D). Partial three-dimensional (3D) integration and 3D-transistor-level integrated circuits have long been anticipated as routes to improve the performance, cost and size of…

As semiconductor manufacturing advances from the 3-nm process toward the sub-nanometer regime and transitions from FinFETs to gate-all-around field-effect transistors (GAAFETs), the resulting complexity and manufacturing challenges continue…

Fast-evolving artificial intelligence (AI) algorithms such as large language models have been driving the ever-increasing computing demands in today's data centers. Heterogeneous computing with domain-specific architectures (DSAs) brings…

Recent literature including our past work provide analysis and solutions for using (i) erasure coding, (ii) parallelism, or (iii) variable slicing/chunking (i.e., dividing an object of a specific size into a variable number of smaller…

Fluorescence microscopy is essential to study biological structures and dynamics. However, existing systems suffer from a tradeoff between field-of-view (FOV), resolution, and complexity, and thus cannot fulfill the emerging need of…

In this letter, a new approach to perform edge detection is presented using an all-dielectric CMOS-compatible metasurface. The design is based on guided-mode resonance which provides a high quality factor resonance to make the edge…

Edge computing enables data processing and storage closer to where the data are created. Given the largely distributed compute environment and the significantly dispersed data distribution, there are increasing demands of data sharing and…

Using a multi-layered printed circuit board, we propose a 3D architecture suitable for packaging supercon- ducting chips, especially chips that contain two-dimensional qubit arrays. In our proposed architecture, the center strips of the…

In this paper we present the theoretical considerations and the design evolution of a proof-of-concept reconfigurable metasurface, primarily used as a tunable microwave absorber, but also as a wavefront manipulation and polarization…