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Photolithography conventionally requires flat, rigid and stable substrates, limiting its applications in flexible, curved, and transient electronics. In this study, a breakthrough approach is reported that employs a reversibly…
Micro-electro mechanical systems (MEMS) thermal flow sensors are increasingly used for compact, low-power flow monitoring in biomedical applications. However, silicon-based method for sensor fabrication is limited by high cost, rigidity,…
We present sample transfer instrumentation and integrated protocols for the preparation and correlative characterization of environmentally-sensitive materials by both atom probe tomography and electron microscopy. Ultra-high vacuum…
We have developed a heat shield based on a metamaterial engineering approach to shield a region from transient diffusive heat flow. The shield is designed with a multilayered structure to prescribe the appropriate spatial profile for heat…
Metal-halide perovskites (MHPs) have exciting optoelectronic properties and are under investigation for various applications, such as photovoltaics, light-emitting diodes, and lasers. An essential step towards exploiting the full potential…
High-quality dielectric films are essential for fabricating advanced electronic devices, but their direct deposition often degrades the films and their underlying interfaces, which compromises device performance, especially on sensitive or…
Kapton HN films, adopted worldwide due to their superior thermal durability (up to 400 {\deg}C), allow the high temperature sintering of nanoparticle based metal inks. By carefully selecting inks and Kapton substrates, outstanding thermal…
Direct nanoimprinting provides a simple and high-throughput route for producing uniform nanopatterns at great precision and at low costs. However, applying this technique to crystalline metals has been considered as impossible due to…
Heat management is crucial for state-of-the-art applications such as passive radiative cooling, thermally adjustable wearables, and camouflage systems. Their adaptive versions, to cater to varied requirements, lean on the potential of…
Deploying fibrous membranes for passive daytime radiative cooling (PDRC) on large and irregular surfaces is highly desirable but remains challenging, owing to the slow deposition rates and the need for electrically conductive substrates in…
Mid-infrared absorption spectroscopy is a well-established technique for non-destructive quantitative molecular analysis. Waveguide-integrated sensors provide a particularly compact solution operating with reduced sample volumes while…
Efficient, low-noise, and high-bandwidth transduction between optical and microwave photons is key to long-range quantum communication between distant superconducting quantum processors. Recent demonstrations of microwave-optical…
Thin films and van der Waals heterostructures derived from two-dimensional solids offer enormous potential for a broad range of novel, energy efficient devices, however, their use is currently hampered by slow, labor-intensive fabrication…
Metallic transition metal dichalcogenides (TMDs) have exhibited various exotic physical properties and hold the promise of novel optoelectronic and topological devices applications. However, the synthesis of metallic TMDs is based on…
In order to make graphene technologically viable, the transfer of graphene films to substrates appropriate for specific applications is required. We demonstrate the dry transfer of epitaxial graphene (EG) from the C-face of 4H-SiC onto…
For applying tensile or compressive uniaxial strain to functional thin films, we propose a novel approach in combining a piezoelectric-based device and a technical metallic substrate used widely in the 2nd generation coated conductors (i.e.…
Low dimensional perovskites are considered good candidates for light emitting applications given the high exciton binding energy which should in principle improve the radiative recombination efficiency. Yet, single-layered two-dimensional…
High throughput characterization and processing techniques are becoming increasingly necessary to navigate multivariable, data-driven design challenges for sensors and electronic devices. For two-dimensional materials, device performance is…
Limited by equipment precision, manufacturing deviations in waveguide width, etch depth, and layer thickness inevitably occur in photonic integrated circuits (PICs). These variations cause initial phase errors, compromising the reliability…
Micro/nano electro-mechanical systems (MEMS/NEMS) are constantly attracting an increasing attention for their relevant technological applications in fields ranging from biology, medicine, ecology, energy to industry. Most of the…