Related papers: Fine Grain 3D Integration for Microarchitecture De…
Monolithic three-dimensional integration of memory and logic circuits could dramatically improve performance and energy efficiency of computing systems. Some conventional and emerging memories are suitable for vertical integration,…
Large language models (LLMs) exhibit memory-intensive behavior during decoding, making it a key bottleneck in LLM inference. To accelerate decoding execution, hybrid-bonding-based 3D-DRAM has been adopted in LLM accelerators. While this…
State Space Models (SSMs) offer a promising alternative to transformers for long-sequence processing. However, their efficiency remains hindered by memory-bound operations, particularly in the prefill stage. While MARCA, a recent first…
Future quantum technology relies crucially on building quantum networks with high fidelity. To achieve this challenging goal, it is of utmost importance to connect single quantum systems in a way such that their emitted single-photons…
To resolve the rising temperatures in 3.5D-ICs, a thermal-aware design flow becomes increasingly crucial, necessitating an accurate and efficient thermal simulation tool. However, previous tools struggle to handle the unique heterogeneous…
Vertically integrated (3D) combinations of sensors and electronics provide the ability to fabricate small, fine pitch pixels with very small total capacitance monolithically integrated with complex circuitry. The small capacitance, enabled…
Thermal management of integrated circuits (ICs) is important to prevent thermal hotspots which are the leading cause of IC failure. Thermal management is even more critical in 3D integrated circuits (3D ICs) as the prevalence of thermal…
The ever-increasing compute performance of GPU accelerators drives up the need for efficient data movements within HPC applications to sustain performance. Proposed as a solution to alleviate CPU-GPU data movement, AMD MI300A Accelerated…
Silicon is an excellent material for microelectronics and integrated photonics with untapped potential for mid-IR optics. Despite broad recognition of the importance of the third dimension, current lithography methods do not allow…
A well-designed fine-grained categorization system usually has three contradictory requirements: accuracy (the ability to identify objects among subordinate categories); interpretability (the ability to provide human-understandable…
The edge computing paradigm has emerged to handle cloud computing issues such as scalability, security and low response time among others. This new computing trend heavily relies on ubiquitous embedded systems on the edge. Performance and…
Writing high performance solvers for engineering applications is a delicate task. These codes are often developed on an application to application basis, highly optimized to solve a certain problem. Here, we present our work on developing a…
Many industries rely on visual insights to support decision- making processes in their businesses. In mining, the analysis of drills and geological shapes, represented as 3D geometries, is an important tool to assist geologists on the…
Over the years, the DRAM latency has not scaled proportionally with its density due to the cost-centric mindset of the DRAM industry. Prior work has shown that this shortcoming can be overcome by reducing the critical length of DRAM access…
In multilevel 3D integrated packaging, three major microstructures are viable due to the application of low volume of solders in different sizes, and/or processing conditions. Thermodynamics and kinetics of binary compounds in Cu/Sn/Cu low…
Fine-grained power estimation in multicore Systems on Chips (SoCs) is crucial for efficient thermal management. BPI (Blind Power Identification) is a recent approach that determines the power consumption of different cores and the thermal…
The strategy of using CUDA-compatible GPUs as a parallel computation solution to improve the performance of programs has been more and more widely approved during the last two years since the CUDA platform was released. Its benefit extends…
The rising use of deep learning and other big-data algorithms has led to an increasing demand for hardware platforms that are computationally powerful, yet energy-efficient. Due to the amount of data parallelism in these algorithms,…
Portable quantum technologies require robust, lightweight apparatus with superior performance. For techniques dependent upon high-vacuum environments, such as atom interferometers and atomic clocks, 3D-printing enables new avenues to tailor…
Composite materials are used across engineering applications for their superior mechanical performance, a result of efficient load transfer between the structure and matrix phases. However, the inherently two-dimensional structure of…