Related papers: Fine Grain 3D Integration for Microarchitecture De…
The evolution of quantization and mixed-precision techniques has unlocked new possibilities for enhancing the speed and energy efficiency of NNs. Several recent studies indicate that adapting precision levels across different parameters can…
Interconnect is one of the main performance determinant of modern integrated circuits (ICs). The new technology of vertical ICs places circuit blocks in the vertical dimension in addition to the conventional horizontal plane. Compared to…
Thermal behavior has become a first-order constraint in advanced 2.5D/3D integrated circuits (ICs) and heterogeneous packages. As power densities rise and multiple active dies are vertically integrated, heat removal paths become…
Given the stringent requirements of energy efficiency for Internet-of-Things edge devices, approximate multipliers, as a basic component of many processors and accelerators, have been constantly proposed and studied for decades, especially…
This paper investigates the multi-GPU performance of a 3D buoyancy driven cavity solver using MPI and OpenACC directives on different platforms. The paper shows that decomposing the total problem in different dimensions affects the strong…
Query co-processing on graphics processors (GPUs) has become an effective means to improve the performance of main memory databases. However, the relatively low bandwidth and high latency of the PCI-e bus are usually bottleneck issues for…
Enhancing performance while reducing costs is the fundamental design philosophy of integrated circuits (ICs). With advancements in packaging technology, interposer-based chiplet architecture has emerged as a promising solution. Chiplet…
Pairing-based cryptography (PBC) is crucial in modern cryptographic applications. With the rapid advancement of adversarial research and the growing diversity of application requirements, PBC accelerators need regular updates in algorithms,…
QMCPACK has enabled cutting-edge materials research on supercomputers for over a decade. It scales nearly ideally but has low single-node efficiency due to the physics-based abstractions using array-of-structures objects, causing…
This study constructs a hybrid module with a multi-material collaborative detection architecture by integrating silicon pixel layers into the longitudinally segmented scintillating fiber sampling calorimeter module and optimizes the…
Visual recognition requires rich representations that span levels from low to high, scales from small to large, and resolutions from fine to coarse. Even with the depth of features in a convolutional network, a layer in isolation is not…
This report focuses on the architecture and performance of the Intelligence Processing Unit (IPU), a novel, massively parallel platform recently introduced by Graphcore and aimed at Artificial Intelligence/Machine Learning (AI/ML)…
Quantum dot (QD) lay-outs are becoming more complex as the technology is being applied to more complex multi-QD structures. This increase in complexity requires improved capacitance modeling both for design and accurate interpretation of QD…
Current approaches to designing energy-efficient applications typically rely on measuring individual components using readily available local metrics, like CPU utilization. However, these metrics fall short when applied to cloud-native…
Photonic integrated circuits utilize planar waveguides to process light on a chip, encompassing functions like generation, routing, modulation, and detection. Similar to the advancements in the electronics industry, photonics research is…
Fueled by their excellent stiffness-to-weight ratio and the availability of mature manufacturing technologies, filament wound carbon fiber reinforced polymers represent ideal materials for thin-walled laminate structures. However, their…
The conflict between stiffness and toughness is a fundamental problem in engineering materials design. However, the systematic discovery of microstructured composites with optimal stiffness-toughness trade-offs has never been demonstrated,…
Heat transfer simulations of the fused filament fabrication process are an important tool to predict bonding, residual stresses and strength of 3D printed parts. But in order to capture the significant thermal gradients that occur in the…
We review threats and selected schemes concerning hardware security at design and manufacturing time as well as at runtime. We find that 3D integration can serve well to enhance the resilience of different hardware security schemes, but it…
The combination of Integrated Sensing and Communication (ISAC) and Mobile Edge Computing (MEC) enables devices to simultaneously sense the environment and offload data to the base stations (BS) for intelligent processing, thereby reducing…