Related papers: Open3DBench: Open-Source Benchmark for 3D-IC Backe…
Thermal simulation plays a fundamental role in the thermal design of integrated circuits, especially 3D ICs. Current simulators require significant runtime for high-resolution simulation, and dismiss the complex nonlinear thermal effects,…
We introduce ForgeEDA, an open-source comprehensive circuit dataset across various categories. ForgeEDA includes diverse circuit representations such as Register Transfer Level (RTL) code, Post-mapping (PM) netlists, And-Inverter Graphs…
The placement of temperature sensitive and safety-critical components is crucial in the automotive industry. It is therefore inevitable, even at the design stage of new vehicles that these components are assessed for potential safety…
Distributed stream processing frameworks help building scalable and reliable applications that perform transformations and aggregations on continuous data streams. This paper introduces ShuffleBench, a novel benchmark to evaluate the…
Parallel and monolithic 3D integration directions offer pathways to realize 3D integrated circuits (ICs) but still lead to layer-by-layer implementations, each functional layer being composed in 2D first. This mindset causes challenging…
This paper presents Omni 3D - a 3D-stacked device architecture that is naturally enabled by back-end-of-line (BEOL)-compatible transistors. Omni 3D arbitrarily interleaves metal layers for both signal/power with FETs in 3D (i.e., nFETs and…
The efficient management and planning of urban energy systems require integrated three-dimensional (3D) models that accurately represent both consumption nodes and distribution networks. This paper introduces our developed geospatial…
High-fidelity simulations of unsteady fluid flow are now possible with advancements in high-performance computing hardware and software frameworks. Since computational fluid dynamics (CFD) computations are dominated by linear algebraic…
As machine learning systems are increasingly deployed in high-stakes domains such as criminal justice, finance, and healthcare, the demand for interpretable and trustworthy models has intensified. Despite the proliferation of local…
Thermal management of integrated circuits (ICs) is important to prevent thermal hotspots which are the leading cause of IC failure. Thermal management is even more critical in 3D integrated circuits (3D ICs) as the prevalence of thermal…
This paper presents and justifies an open benchmark suite named BEEBS, targeted at evaluating the energy consumption of embedded processors. We explore the possible sources of energy consumption, then select individual benchmarks from…
This paper presents a comprehensive study of interactive rendering techniques for large 3D line sets with transparency. The rendering of transparent lines is widely used for visualizing trajectories of tracer particles in flow fields.…
The rapid advancement of three-dimensional integrated circuits (3DICs) has heightened the need for early-phase design space exploration (DSE) to minimize design iterations and unexpected challenges. Emphasizing the pre-register-transfer…
Conventional 2D CMOS technology is reaching fundamental scaling limits, and interconnect bottleneck is dominating integrated circuit (IC) power and performance. While 3D IC technologies using Through Silicon Via or Monolithic Inter-layer…
Researchers have proposed hardware, software, and algorithmic optimizations to improve the computational performance of deep learning. While some of these optimizations perform the same operations faster (e.g., increasing GPU clock speed),…
There is a stage in the GPU computing pipeline where a grid of thread-blocks, in \textit{parallel space}, is mapped onto the problem domain, in \textit{data space}. Since the parallel space is restricted to a box type geometry, the mapping…
The consistent demand for better performance has lead to innovations at hardware and microarchitectural levels. 3D stacking of memory and logic dies delivers an order of magnitude improvement in available memory bandwidth. The price paid…
This paper introduces BioAgent Bench, a benchmark dataset and an evaluation suite designed for measuring the performance and robustness of AI agents in common bioinformatics tasks. The benchmark contains curated end-to-end tasks (e.g.,…
Recently, Google proposes DDVM which for the first time demonstrates that a general diffusion model for image-to-image translation task works impressively well on optical flow estimation task without any specific designs like RAFT. However,…
The continuous scaling of CMOS technology has significantly increased the complexity of very large-scale integrated circuits, driving interest in applying machine learning (ML) to electronic design automation (EDA). However, the limited…