Related papers: Open3DBench: Open-Source Benchmark for 3D-IC Backe…

Open-source EDA tools are rapidly advancing, fostering collaboration, innovation, and knowledge sharing within the EDA community. However, the growing complexity of these tools, characterized by numerous design parameters and heuristics,…

A growing number of Machine Learning Frameworks recently made Deep Learning accessible to a wider audience of engineers, scientists, and practitioners, by allowing straightforward use of complex neural network architectures and algorithms.…

Recently, the increasing use of deep reinforcement learning for flow control problems has led to a new area of research, focused on the coupling and the adaptation of the existing algorithms to the control of numerical fluid dynamics…

This paper aims to create a transition path from file-based IO to streaming-based workflows for scientific applications in an HPC environment. By using the openPMP-api, traditional workflows limited by filesystem bottlenecks can be overcome…

In modern digital circuit back-end design, designers heavily rely on electronic-design-automoation (EDA) tool to close timing. However, the heuristic algorithms used in the place and route tool usually does not result in optimal solution.…

Robotic perception requires the modeling of both 3D geometry and semantics. Existing methods typically focus on estimating 3D bounding boxes, neglecting finer geometric details and struggling to handle general, out-of-vocabulary objects. 3D…

In this work, we proposed a new 3D integration technology: the Flip 3D integration (F3D), consisting of the 3D transistor stacking, the 3D dual-sided interconnects, the 3D die-to-die stacking and the dual-sided Monolithic 3D (M3D). Based on…

The increasing power densities and intricate heat dissipation paths in advanced 2.5D/3D chiplet systems necessitate thermal modeling frameworks that deliver detailed thermal maps with high computational efficiency. Traditional compact…

Data-driven modeling of fluid dynamics has advanced rapidly with neural PDE solvers, yet a fair and strong benchmark remains fragmented due to the absence of unified PDE datasets and standardized evaluation protocols. Although architectural…

We present CrossLoc3D, a novel 3D place recognition method that solves a large-scale point matching problem in a cross-source setting. Cross-source point cloud data corresponds to point sets captured by depth sensors with different…

This paper presents an innovative approach to 3D mixed-size placement in heterogeneous face-to-face (F2F) bonded 3D ICs. We propose an analytical framework that utilizes a dedicated density model and a bistratal wirelength model,…

This work introduces TopoBench, an open-source library designed to standardize benchmarking and accelerate research in topological deep learning (TDL). TopoBench decomposes TDL into a sequence of independent modules for data generation,…

For beyond 2-D CMOS logic, various 3-D integration approaches specially transistor based 3-D integrations such as monolithic 3-D [1], Skybridge [2], SN3D [3] holds most promise. However, such 3D architectures within small form factor…

Three-dimensional topology optimization (TO) is a powerful technique in engineering design, but readily usable, open-source implementations remain limited within the popular Python scientific environment. This paper introduces PyTopo3D, a…

3D scene flow estimation from point clouds is a low-level 3D motion perception task in computer vision. Flow embedding is a commonly used technique in scene flow estimation, and it encodes the point motion between two consecutive frames.…

We propose a systematic framework to conduct design-technology pathfinding for PPAC in advanced nodes. Our goal is to provide configurable, scalable generation of process design kit (PDK) and standard-cell library, spanning key scaling…

Most previous 3D IC research focused on stacking traditional 2D silicon layers, so the interconnect reduction is limited to inter-block delays. In this paper, we propose techniques that enable efficient exploration of the 3D design space…

Thermal analysis is crucial in 3D-IC design due to increased power density and complex heat dissipation paths. Although operator learning frameworks such as DeepOHeat~\cite{liu2023deepoheat} have demonstrated promising preliminary results…

Real-time dense computer vision and SLAM offer great potential for a new level of scene modelling, tracking and real environmental interaction for many types of robot, but their high computational requirements mean that use on mass market…

Thermal issue is a major concern in 3D integrated circuit (IC) design. Thermal optimization of 3D IC often requires massive expensive PDE simulations. Neural network-based thermal prediction models can perform real-time prediction for many…