Related papers: Open3DBench: Open-Source Benchmark for 3D-IC Backe…
We introduce ratatoskr, an open-source framework for in-depth power, performance and area (PPA) analysis in NoCs for 3D-integrated and heterogeneous System-on-Chips (SoCs). It covers all layers of abstraction by providing a NoC hardware…
3D stacked technology has emerged as an effective mechanism to overcome physical limits and communication delays found in 2D integration. However, 3D technology also presents several drawbacks that prevent its smooth application. Two of the…
Three-dimensional integrated circuits (3D ICs) have emerged as a promising solution to the scaling limits of two-dimensional designs, offering higher integration density, shorter interconnects, and improved performance. As design complexity…
Path planning is a key component in mobile robotics. A wide range of path planning algorithms exist, but few attempts have been made to benchmark the algorithms holistically or unify their interface. Moreover, with the recent advances in…
Simulating fluid flow around arbitrary shapes is key to solving various engineering problems. However, simulating flow physics across complex geometries remains numerically challenging and computationally resource-intensive, particularly…
3D integration offers key advantages in improving system performance and efficiency for the End-of-Scaling era. It enables the incorporation of heterogeneous system components and disparate technologies, eliminates off-chip communication…
Parameterizable machine learning (ML) accelerators are the product of recent breakthroughs in ML. To fully enable their design space exploration (DSE), we propose a physical-design-driven, learning-based prediction framework for…
Continuous scaling of CMOS has been the major catalyst in miniaturization of integrated circuits (ICs) and crucial for global socio-economic progress. However, scaling to sub-20nm technologies is proving to be challenging as MOSFETs are…
Detectors based on pixels with timing capabilities are gaining increasing importance in the last years. Next-to-come high-energy physics experiments at colliders require the use of time information in tracking, due to the expected levels of…
To continue scaling beyond 2-D CMOS with 3-D integration, any new 3-D IC technology has to be comparable or better than 2-D CMOS in terms of scalability, enhanced functionality, density, power, performance, cost, and reliability.…
Functional 3D scene graphs offer a versatile and flexible representation for 3D scene understanding and robotic manipulation, defined by object nodes, interactive elements, and functional relationship edges. However, their potential remains…
This work compares open-source electronic design automation tools with a commercial environment using three representative integrated circuit blocks in the IHP 130 nm open PDK: a common-mode noise filter, a finite-state machine, and a…
Deep learning (DL) has been a revolutionary technique in various domains. To facilitate the model development and deployment, many deep learning frameworks are proposed, among which PyTorch is one of the most popular solutions. The…
As the volume of data available from sensor-enabled devices such as vehicles expands, it is increasingly hard for companies to make informed decisions about the cost of capturing, processing, and storing the data from every device. Business…
In this paper we present a new thin-wall eddy current modeling code, ThinCurr, for studying inductively-coupled currents in 3D conducting structures -- with primary application focused on the interaction between currents flowing in coils,…
In this paper, we introduce a novel benchmark designed to propel the advancement of general-purpose, large-scale 3D vision models for remote sensing imagery. While several datasets have been proposed within the realm of remote sensing, many…
Data-driven modeling is becoming central to multiphase transport, electronics cooling, acoustic diagnostics, and thermal-fluid digital twins, but progress is limited by fragmented datasets and raw instrument files that are difficult to…
Three-dimensional integrated circuits promise power, performance, and footprint gains compared to their 2D counterparts, thanks to drastic reductions in the interconnects' length through their smaller form factor. We can leverage the…
AI workloads, particularly those driven by deep learning, are introducing novel usage patterns to high-performance computing (HPC) systems that are not comprehensively captured by standard HPC benchmarks. As one of the largest academic…
Shared memory multiprocessors come back to popularity thanks to rapid spreading of commodity multi-core architectures. As ever, shared memory programs are fairly easy to write and quite hard to optimise; providing multi-core programmers…