Related papers: Advancing SEM Based Nano-Scale Defect Analysis in …
In this research work, we have demonstrated the application of Mask-RCNN (Regional Convolutional Neural Network), a deep-learning algorithm for computer vision and specifically object detection, to semiconductor defect inspection domain.…
Due to potential pitch reduction, the semiconductor industry is adopting High-NA EUVL technology. However, its low depth of focus presents challenges for High Volume Manufacturing. To address this, suppliers are exploring thinner…
Deep learning-based semiconductor defect inspection has gained traction in recent years, offering a powerful and versatile approach that provides high accuracy, adaptability, and efficiency in detecting and classifying nano-scale defects.…
With continuous progression of Moore's Law, integrated circuit (IC) device complexity is also increasing. Scanning Electron Microscope (SEM) image based extensive defect inspection and accurate metrology extraction are two main challenges…
Continual shrinking of pattern dimensions in the semiconductor domain is making it increasingly difficult to inspect defects due to factors such as the presence of stochastic noise and the dynamic behavior of defect patterns and types.…
This proposes a novel ensemble deep learning-based model to accurately classify, detect and localize different defect categories for aggressive pitches and thin resists (High NA applications).In particular, we train RetinaNet models using…
Integrated circuit manufacturing is highly complex, comprising hundreds of process steps. Defects can arise at any stage, causing yield loss and ultimately degrading product reliability. Supervised methods require extensive human annotation…
Artificial Intelligence has gained a lot of attention recently, it has been utilized in several fields ranging from daily life activities, such as responding to emails and scheduling appointments, to manufacturing and automating work…
In semiconductor manufacturing, lithography has often been the manufacturing step defining the smallest possible pattern dimensions. In recent years, progress has been made towards high-NA (Numerical Aperture) EUVL…
A growing need exists for efficient and accurate methods for detecting defects in semiconductor materials and devices. These defects can have a detrimental impact on the efficiency of the manufacturing process, because they cause critical…
Anomaly Detection and Segmentation (AD&S) is crucial for industrial quality control. While existing methods excel in generating anomaly scores for each pixel, practical applications require producing a binary segmentation to identify…
Automated surface-anomaly detection using machine learning has become an interesting and promising area of research, with a very high and direct impact on the application domain of visual inspection. Deep-learning methods have become the…
This paper addresses the problem of defect segmentation in semiconductor manufacturing. The input of our segmentation is a scanning-electron-microscopy (SEM) image of the candidate defect region. We train a U-net shape network to segment…
In this review, automatic defect inspection algorithms that analyze Scanning Electron Microscopy (SEM) images for Semiconductor Manufacturing (SM) are identified, categorized, and discussed. This is a topic of critical importance for the SM…
Along with the breakthrough of convolutional neural networks, learning-based segmentation has emerged in many research works. Most of them are based on supervised learning, requiring plenty of annotated data; however, to support…
Precise optical inspection in industrial applications is crucial for minimizing scrap rates and reducing the associated costs. Besides merely detecting if a product is anomalous or not, it is crucial to know the distinct type of defect,…
Industrial product inspection is often performed using Anomaly Detection (AD) frameworks trained solely on non-defective samples. Although defective samples can be collected during production, leveraging them usually requires pixel-level…
Automatic defect detection for 3D printing processes, which shares many characteristics with change detection problems, is a vital step for quality control of 3D printed products. However, there are some critical challenges in the current…
Deep convolutional neural networks (CNNs) have been widely used in surface defect detection. However, no CNN architecture is suitable for all detection tasks and designing effective task-specific requires considerable effort. The neural…
The efficacy of Artificial Intelligence (AI) in micro/nano manufacturing is fundamentally constrained by the scarcity of high-quality and physically grounded training data for defect inspection. Lithography defect data from semiconductor…