Related papers: Selecting Alternative Metals for Advanced Intercon…
Analog Ising machines (IMs) occupy an increasingly prominent area of computer architecture research, offering high-quality and low latency/energy solutions to intractable computing tasks. However, IMs have a fixed capacity, with little to…
The design of correlated materials challenges researchers to combine the maturing, high throughput framework of DFT-based materials design with the rapidly-developing first-principles theory for correlated electron systems. We review the…
Rapid progress in additive manufacturing methods has created a new class of ultralight and strong architected metamaterials that resemble periodic truss structures. The mechanical performance of these metamaterials with a very large number…
Introducing foreign ions, atoms, or molecules into emerging functional materials is crucial for manipulating material physical properties and innovating device applications. The intercalation of emerging new materials can induce multiple…
All-dielectric metamaterials consisting of high-dielectric inclusions in a low-dielectric matrix are considered as a low-loss alternative to resonant metal-based metamaterials. In this contribution we investigate the applicability of the…
Scaling transistors' dimensions has been the thrust for the semiconductor industry in the last 4 decades. However, scaling channel lengths beyond 10 nm has become exceptionally challenging due to the direct tunneling between source and…
The sharp increase in resistivity of copper interconnects at ultra-scaled dimensions threatens the continued miniaturization of integrated circuits. Topological semimetals (TSMs) with gapless surface states (Fermi arcs) provide conduction…
A common issue in low temperature measurements of enhancement-mode metal-oxide-semiconductor (MOS) field-effect transistors (FETs) in the low electron density regime is the high contact resistance dominating the device impedance. In that…
While 2D materials have enormous potential for future device technologies, many challenges must be overcome before they can be deployed at an industrial scale. One of these challenges is identifying the right semiconductor/insulator…
Resistivity augmentation in nanoscale metal interconnects is a performance limiting factor in integrated circuits. Here we present calculations of electron scattering and transmission at the interface between Cu interconnects and their…
Superconducting metamaterials are utilized to study the approach to the plasmonic limit simply by tuning temperature to modify the superfluid density, and thus the superfluid plasma frequency. We examine the persistence of artificial…
Transparent conducting oxides (TCOs) are central to optoelectronic technologies, yet their design is often guided by popular figures of merit that are disconnected from the electrical requirement of actual devices. As a result, widely used…
In the realm of PCB and packaging interconnect design, electromagnetic analysis tools have transitioned from optional to essential over the last two decades, as data rates soared beyond 6 Gbps. Today, with standard data rates eclipsing 6…
Comparing with the conventional semiconductors, the choice of the two dimensional semiconductor (2DSC) materials is very limited. Based on proper electron counting, we propose a large family of 2DSCs, all adopting the same structure and…
A number of electronic devices involve metal/oxide interfaces in their structure where the oxide layer plays the role of electrical insulator. As the downscaling of devices continues, the oxide thickness can spread over only a few atomic…
We experimentally investigate inductively shunted transmon-type artificial atoms as an alternative to address the challenges of low anharmonicity and the need for strong charge dispersion in superconducting quantum systems. We characterize…
Nonlinear interferometers with correlated photons hold a promise to advance optical characterization and metrology techniques by improving their performance and affordability. Nonlinear interferometers offer the sub-shot noise phase…
This paper studies the robustness of large-scale interconnected systems with respect to external disturbances, focussing on their scalability properties. Specifically, a notion of scalability is introduced that asks for these robustness…
Multivalent batteries are an energy storage technology with the potential to surpass lithium-ion batteries, however their performance has been limited by the low voltages and poor solid-state ionic mobility of available cathodes. A…
Advanced engineering materials design involves the exploration of massive multidimensional feature spaces, the correlation of materials properties and the processing parameters derived from disparate sources. The search for alternative…