Progress in Decompositional Electromagnetic Analysis of Digital Interconnects
Abstract
In the realm of PCB and packaging interconnect design, electromagnetic analysis tools have transitioned from optional to essential over the last two decades, as data rates soared beyond 6 Gbps. Today, with standard data rates eclipsing 6 Gbps and reaching thresholds of 224 Gbps, these tools are indispensable for designing reliable interconnects. The goals of the interconnect analysis are simple: identify interconnects that may fail at the target data rate and allow troubleshooting and fixing the problem. The most efficient approach to such pass-fail analysis is the Decompositional Electromagnetic Analysis (DEA). It allows separation of the signal degradation factors for faster analysis and troubleshooting. This paper outlines the basic elements of DEA, discusses conditions for its accuracy and underscores its significance in the future of interconnect design.
Keywords
Cite
@article{arxiv.2412.09639,
title = {Progress in Decompositional Electromagnetic Analysis of Digital Interconnects},
author = {Yuriy Shlepnev},
journal= {arXiv preprint arXiv:2412.09639},
year = {2026}
}
Comments
Accepted at 2026 IEEE EMC+SIPI. (c) 2026 IEEE. Personal use of this material is permitted. Permission from IEEE must be obtained for all other uses, in any current or future media, including reprinting/republishing this material for advertising or promotional purposes, creating new collective works, for resale or redistribution to servers or lists