Related papers: Timing resolution performance of Timepix4 bump-bon…

We present the design and performance of a prototype ASIC digitizer for integrated wire chamber readout, implemented in 65 nm commercial CMOS technology. Each channel of the 4-channel prototype is composed of two 16-bit Time-to-Digital…

Hybrid pixel detectors have a well-established array of applications ranging from particle physics to life sciences. The small dimensions of Timepix3 as well as its relatively low energetic expenses make it an intriguing option additionally…

A silicon pixel detector with fine pitch size of 19x19 um, developed base on SOI (silicon on insulator) technology, was tested under the illumination of infrared laser pulses. As an alternative way to particle beam tests, the laser pulses…

We performed an experimental study to determine the pixel recovery time of various Multi Pixel Photon Counters (MPPCs) in order to characterize their rate capability and double-hit resolution. The recovery time constant and its dependence…

The experiment of the future electron-positron colliders has unprecedented requirements on the vertex resolution, such as around 3micron single point resolution for the inner most detector layer, with fast readout, and very low…

In this report, we derive analytical expressions for the time resolution limits of standard silicon sensors, LGADs, and 3D trench sensors. We separately examine the effects of Landau fluctuations and electronic noise. To analyze Landau…

The time resolution for a charged particle detection is reported for a typical scintillating fiber detector instrumented with Rockwell HISTE-IV Visible Light Photon Counters. The resolution measurements are shown to agree with a simple…

Integrated time-bin-entangled photon-pair source with cavity-enhanced nonlinear optical processes is essential for quantum information technologies. However, microcavities with a high quality factor inherently introduce a trade-off between…

The ALICE Inner Tracking System upgrade (ITS3) will employ stitched, wafer-scale Monolithic Active Pixel Sensors (MAPS) for the first time in high-energy physics, achieving a material budget of only 0.09$\,$%$\,$X$\mathrm{_{0}}$ per layer.…

The current state of the art in fast timing resolution for existing experiments is of the order of 100 ps on the time of arrival of both charged particles and electromagnetic showers. Current R&D on charged particle timing is approaching…

This contribution investigates a prototype of a TPC readout with a highly pixelated CMOS ASIC, which is an option for charged particles tracking of the ILC. A triple GEM stack was joined with a TimePix and MediPix2 chip (pixel size of…

Active edge p-on-p silicon pixel detectors with thickness of 100 $\mu$m were fabricated on 150 mm Float zone silicon wafers at VTT. By combining measured results and TCAD simulations, a detailed study of electric field distributions and…

Zone-folded acoustic phonons (6 THz) in 4H silicon carbide (SiC) have been coherently excited using a femtosecond near-infrared pulse and measured through transient reflectivity with a pump and probe protocol. Their amplitude is coherently…

Performance of a simple method of particle identification via pulse rise time discrimination is demonstrated for slow pulses from charge-sensitive preamplifiers with rise times ranging from 10 ns to 500 ns. The method is based on a…

The event-driven hybrid-pixel detector readout chip, Timepix3, has the ability to simultaneously measure the time of an event on the nanosecond timescale and the energy deposited in the sensor. However, the behaviour of the system when two…

We investigate the application of amplitude-shaped control pulses for enhancing the time and frequency resolution of multipulse quantum sensing sequences. Using the electronic spin of a single nitrogen vacancy center in diamond and up to…

We present a comprehensive characterization of resistive PICOSEC Micromegas detector prototypes, tested under identical conditions, constant drift gap, field configurations, and photocathode at the CERN SPS H4 beam line. This work provides…

The proof-of-concept prototype of the Picosecond Avalanche Detector, a multi-PN junction monolithic silicon detector with continuous gain layer deep in the sensor depleted region, was tested with a beam of 180 GeV pions at the CERN SPS. The…

The performance of pixel modules built from 75 micrometer thin silicon sensors and ATLAS read-out chips employing the Solid Liquid InterDiffusion (SLID) interconnection technology is presented. This technology, developed by the Fraunhofer…

In order to achieve the challenging requirements on the CLIC vertex detector, a range of technology options have been considered in recent years. One prominent idea is the use of active sensors implemented in a commercial high-voltage CMOS…