Related papers: Pixel detector hybridization and integration with …

We present a concept to improve the spatial resolution of silicon pixel-detectors via the implementation of a sub-pixel cross-coupling, which introduces directional charge sharing between pixels. The charge-collection electrode is segmented…

The Adaptive Gain Integrating Pixel Detector (AGIPD) is a novel detector system, currently under development by a collaboration of DESY, the Paul Scherrer Institute in Switzerland, the University of Hamburg and the University of Bonn, and…

The Adaptive Gain Integrating Pixel Detector (AGIPD) is an x-ray imager, custom designed for the European x-ray Free-Electron Laser (XFEL). It is a fast, low noise integrating detector, with an adaptive gain amplifier per pixel. This has an…

Integrated photodetectors are essential components of scalable photonics platforms for quantum and classical applications. However, most efforts in the development of such devices to date have been focused on infrared telecommunications…

Reconfigurable photonic integrated circuits (PICs) can implement arbitrary operations and signal processing functionalities directly in the optical domain. Run-time configuration of these circuits requires an electronic control layer to…

We discuss a new class of Micro Pattern Gas Detectors, the Gas Pixel Detector (GPD), in which a complete integration between the gas amplification structure and the read-out electronics has been reached. An Application-Specific Integrated…

The High Luminosity upgrade of the CERN Large Hadron Collider (HL-LHC) requires new high-radiation tolerant silicon pixel sensors for the innermost part of the tracking detector in the CMS experiment. The innermost layer of the tracker,…

Dielectric optical waveguides constitute the main building blocks of photonic integrated circuits (PICs). Channels with high refractive index contrast can provide very compact PIC components whereas structures with lower index exhibit less…

This work presents a novel solution for the packaging of ALPIDE chips that facilitates non-planar assembly with a minimal material budget. This solution represents a technological advancement based on methodologies developed for the ALICE…

Hybrid pixel detectors have been invented for the LHC to make tracking and vertexing possible at all in LHC's radiation intense environment. The LHC pixel detectors have meanwhile very successfully fulfilled their promises and R\&D for the…

Timepix and Timepix3 are hybrid pixel detectors ($256\times 256$ pixels), capable of tracking ionizing particles as isolated clusters of pixels. To efficiently analyze such clusters at potentially high rates, we introduce multiple…

The ATLAS pixel detector is a high precision silicon tracking device located closest to the LHC interaction point. It belongs to the first generation of its kind in a hadron collider experiment. It will provide crucial pattern recognition…

Silicon detectors typically require an insensitive area around their periphery to accommodate guard rings, which help maintain the electric field uniformity around edge pixels and isolate the high leakage current from the physical edges of…

CMOS pixel sensors (CPS) represent a novel technological approach to building charged particle detectors. CMOS processes allow to integrate a sensing volume and readout electronics in a single silicon die allowing to build sensors with a…

The performance of novel n-in-p planar pixel detectors, designed for future upgrades of the ATLAS Pixel system is presented. The n-in-p silicon sensors technology is a promising candidate for the pixel upgrade thanks to its radiation…

We present a method of embedding a Monolithic Active Pixel Sensor (MAPS) into a flexible printed circuit board (FPC) and its interconnection by means of through-hole copper plating. The resulting assembly, baptised "MAPS foil", is a…

During the ATLAS phase II upgrade, the tracking system of the ATLAS experiment will be replaced by an all-silicon detector called the inner tracker (ITK) with a pixel detector as the most inner part. The monitoring data of the new system…

Coherent technology inherent with more availabledegrees of freedom is deemed a competitive solution for nextgeneration ultra-high-speed short-reach optical interconnects.However, the fatal barriers to implementing the conventiona.coherent…

Today, continued miniaturization in electronic integrated circuits (ICs) appears to have reached its fundamental limit. At the same time, energy consumption due by communication becomes the dominant limitation in high performance electronic…

Co-Packaged Optics applications require scalable and high-yield optical interfacing solutions to silicon photonic chiplets, offering low-loss, broadband, and polarization-independent optical coupling while maintaining compatibility with…