Related papers: Pixel detector hybridization and integration with …
At least 25 kinds of detector-like devices need to be integrated in Phase I of the High Energy Photon Source (HEPS), and the work needs to be carefully planned to maximise productivity with highly limited human resources. After a systematic…
Reliable integration of photonic integrated circuits (PICs) into quantum sensors has the potential to drastically reduce sensor size, ease manufacturing scalability, and improve performance in applications where the sensor is subject to…
Future space-based X-ray telescope missions are likely to have significantly increased demands on detector read out rates due to increased collection area, and there will be a desire to minimize radiation damage in the interests of…
Epitaxial semiconductor-superconductor heterostructures are promising as a platform for gate-tunable superconducting electronics. Thus far, the superconducting properties in such hybrid systems have been predicted based on simplified…
The ATLAS pixel detector is the innermost detector of the ATLAS experiment at the Large Hadron Collider at CERN. With approximately 80 million readout channels, the ATLAS silicon pixel detector is a high-acceptance, high-resolution,…
Following the Phase-II upgrade during Long Shutdown (LS3), the LHC aims to reach a peak instantaneous luminosity of $7.5\times 10^{34}$cm$^{-2}$s$^{-1}$, which corresponds to an average of around 200 inelastic proton-proton collisions per…
Photonic integrated circuits utilize various waveguide materials, each excelling in specific metrics like efficient light emission, low propagation loss, high electro-optic efficiency, and potential for mass production. Inherent…
Particle IDentification (PID) is a central requirement of the experiments at the future EIC. Hadron PID at high momenta by RICH techniques requires the use of low density gaseous radiators, where the challenge is the limited length of the…
To measure light emission pattern in scintillator, higher sensitivity and faster response are required to photo detector. Such as single photon avalanche diode (SPAD), conventional pixelated photo detector is operated at Geiger avalanche…
Dense tracking environments in experiments at CERN's High-Luminosity LHC and future FCC experiments call for an increased use of timing information in addition to the position measurement of pixel detectors. This adds one dimension to the…
Active Pixel Sensor (APS) technology has shown promise for next-generation vertex detectors. This paper discusses the design and testing of two generations of APS chips. Both are arrays of 128 by 128 pixels, each 20 by 20 micro-m. Each…
Deterministic positioning and assembly of colloidal nanoparticles (NPs) onto substrates is a core requirement and a promising alternative to top down lithography to create functional nanostructures and nanodevices with intriguing optical,…
Monolithic active pixel sensors produced in High Voltage CMOS (HV-CMOS) technology are being considered for High Energy Physics applications due to the ease of production and the reduced costs. Such technology is especially appealing when…
The ALICE Inner Tracking System has been recently upgraded to a full silicon detector consisting entirely of MAPS, arranged in seven concentric layers around the LHC beam pipe. Further ahead, during the LHC Long Shutdown 3, the ALICE…
Pixel sensors based on commercial high-voltage CMOS processes are an exciting technology that is considered as an option for the outer layer of the ATLAS inner tracker upgrade at the High Luminosity LHC. Here, charged particles are detected…
Efficient coupling of III-V light sources to silicon photonic circuits is one of the key challenges of integrated optics. Important requirements are low coupling losses, as well as small footprint and high yield of the overall assembly,…
To fully exploit the increased luminosity of the HL-LHC, the CMS Inner Tracker is undergoing a major upgrade to withstand extreme radiation levels and data rates, while improving granularity and reducing material budget. The upgraded…
The hybrid pixel detectors used in the high energy physics experiments currently under construction use a three dimensional connection technique, the so-called bump bonding. As the pitch below 100um, required in these applications, cannot…
The Multi-Chip-Module-Deposited (MCM-D) technique has been used to build hybrid pixel detector assemblies. This paper summarises the results of an analysis of data obtained in a test beam campaign at CERN. Here, single chip hybrids made of…
Hybrid integration of plasmonics and Si photonics is a promising architecture for global microprocessor interconnects. To this end, practical plasmonic devices not only should provide athermal, broadband operation over wavelength-scale…