Related papers: MiniCACTUS: A 65 ps Time Resolution Depleted Monol…

A CMOS pixel sensor, named Supix-1, is developed for a pixelated silicon tracker for the Circular Electron-Positron Collider (CEPC) project. The sensor, consisted of nine sectors varying in pixel sizes, diode sizes and geometries, is…

The high-luminosity upgrade of the CERN LHC requires the replacement of the CMS tracking detector to cope with the increased radiation fluence while maintaining its excellent performance. An extensive R\&D program, aiming at using 3D pixel…

An array of DEPFET pixels is one of several concepts to implement an active pixel sensor. Similar to PNCCD and SDD detectors, the typically 0.45 mm thick silicon sensor is fully depleted by the principle of sideward depletion. They have…

IDeF-X HD is a 32-channel analog front-end with self-triggering capability optimized for the readout of 16 x 16 pixels CdTe or CdZnTe pixelated detectors to build low power micro gamma camera. IDeF-X HD has been designed in the standard AMS…

We have operated a Medipix2 CMOS readout chip, with amplifying, shaping and charge discriminating front-end electronics integrated on the pixel-level, as a highly segmented direct charge collecting anode in a three-stage gas electron…

To cope with the challenging environment of the planned high luminosity upgrade of the Large Hadron Collider (HL-LHC), scheduled to start operation in 2029, CMS will replace its entire tracking system. The requirements for the tracker are…

The precise reconstruction of Compton-scatter events is paramount for an imaging medium-energy gamma-ray telescope. The proposed AMEGO-X is enabled by a silicon tracker utilizing AstroPix chips - a pixelated silicon HVCMOS sensor novel for…

We introduce the fully-depleted charge-coupled device (CCD) as a particle detector. We demonstrate its low energy threshold operation, capable of detecting ionizing energy depositions in a single pixel down to 50 eVee. We present results of…

Edge-TCT and charge collection measurements with passive test structures made in LFoundry 150 nm CMOS process on p-type substrate with initial resistivity of over 3 k$\Omega$cm are presented. Measurements were made before and after…

The next-generation ALICE 3 experiment at the High-Luminosity LHC (HL-LHC) requires detector technologies that combine fine spatial resolution, fast timing, and an extremely low material budget. This paper presents the design,…

During the Long Shutdown 3 (LS3, scheduled 2026-2030), the innermost 3 layers (Inner Barrel, or IB) of the present ALICE ITS2 will be replaced with large-area, flexible, stitched CMOS 65 nm sensors, arranged in 2 half-barrels of 3…

Fully Depleted Monolithic Active Pixels (FD-MAPS) represent a state-of-the-art detector technology and profit from a low material budget and cost for high energy physics experiments and other fields of research like medical imaging and…

In order to achieve the challenging requirements on the CLIC vertex detector, a range of technology options have been considered in recent years. One prominent idea is the use of active sensors implemented in a commercial high-voltage CMOS…

The prospect of pileup induced backgrounds at the High Luminosity LHC (HL-LHC) has stimulated intense interest in developing technologies for charged particle detection with accurate timing at high rates. The required accuracy follows…

We present the first characterization results of Timespot1, an ASIC designed in CMOS 28 nm technology, featuring a $32 \times 32$ pixel matrix with a pitch of $55 ~ \mu m$. Timespot1 is the first small-size prototype, conceived to readout…

CMOS sensors were successfully implemented in the STAR tracker [1]. LHC experiments have shown that efficient b tagging, reconstruction of displaced vertices and identification of disappearing tracks are necessary. An improved vertex…

The current state of the art in fast timing resolution for existing experiments is of the order of 100 ps on the time of arrival of both charged particles and electromagnetic showers. Current R&D on charged particle timing is approaching…

A 100um thick silicon detector with 1mm2 pad readout optimized for sub-nanosecond time resolution has been developed and tested. Coupled to a purposely developed amplifier based on SiGe HBT technology, this detector was characterized at the…

High-resolution 3D tracking with sub-nanosecond timing is required for the detection of elementary particles, such as neutrinos. Conventional detectors, which utilize analog silicon photomultipliers, face challenges in balancing spatial…

We report the design and characterization of a CMOS pixel direct charge sensor, Topmetal-II-, fabricated in a standard 0.35um CMOS Integrated Circuit process. The sensor utilizes exposed metal patches on top of each pixel to directly…