Related papers: MiniCACTUS: A 65 ps Time Resolution Depleted Monol…

The recent R&D focus on CMOS sensors with charge collection in a depleted zone has opened new perspectives for CMOS sensors as fast and radiation hard pixel devices. These sensors, labelled as depleted CMOS sensors (DMAPS), have already…

The physics aims at the proposed future high-energy linear $e^+e^-$ collider CLIC pose challenging demands on the performance of the detector system. In particular, the vertex and tracking detectors have to combine a spatial resolution of a…

High-voltage CMOS (HV-CMOS) pixel technology is being considered for future Higgs factory experiments. The ATLASPix3.1 chip, with a pitch of 50$\mu m$ x 150$\mu m$, fabricated using TSI 180nm HV-CMOS technology, is a full reticle-size…

A novel readout architecture that uses multiple non-destructive floating-gate amplifiers to achieve sub-electron readout noise in a thick, fully-depleted silicon detector is presented. This Multi-Amplifier Sensing Charge-Coupled Device…

A plug-and-play PhotonPix single-photon detector with a logical signal output is developed for applications requiring ultimate timing precision down to 10 ps over a wide dynamic photon flux range. The heart of the detector is an Exosens…

The PICOSEC Micromegas detector is a~precise-timing gaseous detector based on a~Cherenkov radiator coupled with a~semi-transparent photocathode and a~Micromegas amplifying structure, targeting a~time resolution of tens of picoseconds for…

This paper presents the design and results of detailed tests of a CMOS active pixel chip for charged particle detection with in-pixel charge storage for correlated double sampling and readout in rolling shutter mode at frequencies up to 25…

Significant progress has been made to develop silicon pixel technologies for use in the vertex and tracker regions of the proposed Compact Linear Collider (CLIC) detector design. The electron-positron collisions generated by this linear…

We report spectral and imaging performance of a pixelated CdZnTe detector custom designed for the \emph{MeVCube} project: a small Compton telescope on a CubeSat platform. \emph{MeVCube} is expected to cover the energy range between…

The ALICE collaboration is preparing an upgrade of the three innermost layers of the current Inner Tracking System (ITS) during the next LHC long shutdown (LS3). The new ITS detector will use wafer-scale (up to \SI{27}{cm} in length)…

Thin planar pixel modules are promising candidates to instrument the inner layers of the new ATLAS pixel detector for HL-LHC, thanks to the reduced contribution to the material budget and their high charge collection efficiency after…

The PICOSEC Micromegas (MM) detector is a precise timing gaseous detector consisting of a Cherenkov radiator combined with a photocathode and a MM amplifying structure. A 100-channel non-resistive PICOSEC MM prototype with 10x10 cm^2 active…

The radiation hardness of passive CMOS pixel sensors fabricated in 150 nm LFoundry technology is investigated. CMOS process lines are especially of interest for large-scale silicon detectors as they offer high production throughput at…

The concept of capacitive coupling between sensors and readout chips is under study for the vertex detector at the proposed high-energy CLIC electron positron collider. The CLICpix Capacitively Coupled Pixel Detector (C3PD) is an active…

Atomic clocks play a crucial role in timekeeping, communications, and navigation systems. Recent efforts enabled by heterogeneous MEMS integration have led to the commercial introduction of Chip-Scale Atomic Clocks (CSAC) with a volume of…

The MIP Timing Detector will provide additional timing capabilities for detection of minimum ionizing particles (MIPs) at CMS during the High Luminosity LHC era, improving event reconstruction and pileup rejection. The central portion of…

The Super Tau-Charm Facility (STCF) is a proposed $e^+e^-$ collider with a peak luminosity 100 times higher than that of the present tau-charm factory. The inner tracker (ITK) of STCF should feature a low material budget and high readout…

A 1M- and a 4M-pixel monolithic CMOS active pixel sensor with 9.5x9.5 micron^2 pixels have been developed for direct imaging in transmission electron microscopy as part of the TEAM project. We present the design and a full characterisation…

Depleted monolithic active pixel sensors (DMAPS), which exploit high voltage and/or high resistivity add-ons of modern CMOS technologies to achieve substantial depletion in the sensing volume, have proven to have high radiation tolerance…

We have developed a prototype system for the ILC vertex detector based on DEPFET pixels. The system operates a 128x64 matrix (with ~35x25 square micron large pixels) and uses two dedicated microchips, the SWITCHER II chip for matrix…