Related papers: Microsecond non-melt UV laser annealing for future…
The state-of-the-art CMOS technology has started to adopt three-dimensional (3D) integration approaches, enabling continuous chip density increment and performance improvement, while alleviating difficulties encountered in traditional…
The need of surface-localized thermal processing is strongly increasing especially w.r.t three-dimensionally (3D) integrated electrical devices. UV laser annealing (UV-LA) technology well addresses this challenge. Particularly UV-LA can…
UV laser annealing (UV-LA) enables surface-localized high-temperature thermal processing to form abrupt junctions in emerging monolithically stacked devices, where the applicable thermal budget is restricted. In this work, UV-LA is…
UV laser annealing (UV-LA) enables surface-localized high-temperature thermal processing to form abrupt junctions in emerging monolithically stacked devices, where applicable thermal budget is restricted. In this work, UV-LA is performed to…
UV nanosecond pulsed laser annealing (UV NLA) enables both surface-localized heating and short timescale high temperature processing, which can be advantageous to reduce metal line resistance by enlarging metal grains in lines or in thin…
Ultraviolet nanosecond laser annealing (UV-NLA) proves to be an important technique, particularly when tightly controlled heating and melting are necessary. In the realm of semiconductor technologies, the significance of nanosecond laser…
Microscale additive manufacturing of reflective copper is becoming increasingly important for microelectronics and microcomputers, due to its excellent electrical and thermal conductivity. Yet, it remains challenging for state-of-the-art…
We demonstrate a hybrid laser microfabrication approach, which combines the technical merits of ultrafast laser-assisted chemical etching and carbon dioxide laser-induced in-situ melting, for centimeter-scale and bonding-free fabrication of…
While ultrafast laser welding is an appealing technique for bonding transparent workpieces, it is not applicable for joining silicon samples due to nonlinear propagation effects which dramatically diminishes the possible energy deposition…
The concept of dielectric-laser acceleration (DLA) provides the highest gradients among breakdown-limited (nonplasma) particle accelerators and thus the potential of miniaturization. The implementation of a fully scalable electron…
Ultraviolet nanosecond laser annealing (LA) is a powerful tool where strongly confined heating and melting are desirable. In semiconductor technologies the importance of LA increases with the increasing complexity of the proposed…
The concept of Dielectric Laser Acceleration (DLA) provides highest gradients among non-plasma particle accelerators. However, stable beam transport and staging have not been shown experimentally yet. We present a scheme that confines the…
Applications such as augmented and virtual reality (AR/VR), optical atomic clocks, and quantum computing require photonic integration of (near-)visible laser sources to enable commercialization at scale. The heterogeneous integration of…
Due to its exceptional dimensional stability in harsh thermal conditions and excellent mechanical and optical properties, Corning ultra-low expansion (ULE) glass is the material of choice in many high-demanding fields such as aerospace,…
We report on a laser annealing procedure which greatly improves the quality of suspended monolayers of chemical vapor deposition (CVD) grown MoSe2. Annealing with a green laser locally heats the suspended flake to approximately 600 K, which…
Semiconductor lasers with ultra-low thresholds and minimal footprints are a topic of active research. Such devices require a combination of high quality factor laser cavities with small active region volumes, which drives the quest for…
Elemental selenium is a promising wide-bandgap ($E_\mathrm{G}\approx$ 1.95 eV) photovoltaic material for the next generation of thin-film solar cells. To realize high-efficiency selenium solar cells, it is crucial to optimize the…
The development of compact, energy-efficient integrated lasers operating at 1.3 um remains a critical focus in silicon photonics, essential for advancing data communications and optical interconnect technologies. This paper presents a…
Black body materials prove promising candidates to meet future energy demands as they are able to harvest energy from the total bandwidth of solar radiation. Here, we report on high absorption (> 98 %) near-black body-like structures…
Large-scale, high-precision, and high-transparency microchannels hold great potential for developing high-performance continuous-flow photochemical reactions. We demonstrate ultrafast laser-enabled fabrication of 3D microchannel reactors in…