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The CDEX (China Dark matter Experiment) is currently in the stage to upgrade to approximately 10 kg HPGe (High Purity Germanium) detectors (CDEX-10) in CJPL (China Jinping Underground Laboratory) and aims to detect the WIMP (Weakly…

High resolution image sensors require electrical access to each individual pixel for signal readout. Such access is especially challenging for ultra-miniaturized pixels, for heterogeneously integrated sensing and readout layers in…

The memristor, because of its controllability over a wide dynamic range of resistance, has emerged as a promising device for data storage and analog computation. A major challenge is the accurate measurement of memristance over a wide…

The high-luminosity upgrade of the LHC (HL-LHC) brings unprecedented requirements for precision bunch-by-bunch luminosity measurement and beam-induced background monitoring in real time. A key component of the CMS Beam Radiation…

The CLARO-CMOS is an application specific integrated circuit (ASIC) designed for fast photon counting with pixellated photodetectors such as multi-anode photomultiplier tubes (Ma-PMT), micro-channel plates (MCP), and silicon…

This paper presents the design and results of detailed tests of a CMOS active pixel chip for charged particle detection with in-pixel charge storage for correlated double sampling and readout in rolling shutter mode at frequencies up to 25…

The Muon Upgrade Phase II of the Compact Muon Solenoid (CMS) aims to guarantee the optimal conditions of the present system and extend the $\eta$ coverage to ensure a reliable system for the High Luminosity Large Hadron Collider (HL-LHC)…

In order to achieve its ambitious luminosity target, the SuperKEKB collider must achieve and sustain high beam currents on the order of Ampere in its storage rings. This requires continuous top-up injection and operation with a two-bunch…

A new tracking detector will be installed as part of the Phase-2 upgrade of the CMS detector for the high-luminosity LHC era. This tracking detector includes the Inner Tracker, equipped with silicon pixel sensor modules, and the Outer…

The High Energy Photon Source (HEPS) represents a fourth-generation light source. This facility has made unprecedented advancements in accelerator technology, necessitating the development of new detectors to satisfy physical requirements…

This paper presents a novel pixel chip readout scheme: the Region-of-Interest Readout Circuit (ROIRC), which is designed for large area, large array pixel chips and Gas Pixel Detector (GPD). This design employs a sentinel pixel detection…

Pixel detectors are used in the innermost part of the multi purpose experiments at LHC and are therefore exposed to the highest fluences of ionising radiation, which in this part of the detectors consists mainly of charged pions. The…

Results obtained with 3D columnar pixel sensors bump-bonded to the RD53A prototype readout chip are reported. The interconnected modules have been tested in a hadron beam before and after irradiation to a fluence of about…

The Analog Pipeline Chip (APC) is a low noise, low power readout chip for silicon micro strip detectors with 128 channels containing an analog pipeline of 32 buffers depth. The chip has been designed for operation at HERA with a power…

The detector of TRopIcal DEep-sea Neutrino Telescope (TRIDENT) will use large-area silicon photomultiplier (SiPM) arrays combined with photomultiplier tubes to boost photon detection efficiency and pointing capability. An…

A new downstream tracking system, known as the Mighty Tracker, is planned to be installed at LHCb during LS4 of the LHC. This will allow an increase in instantaneous luminosity from $2\cdot10^{33}~\mathrm{cm}^{-2}\mathrm{s}^{-1}$ to…

The LHC Phase-II upgrade will lead to a significant increase in luminosity, which in turn will bring new challenges for the operation of inner tracking detectors. A possible solution is to use active silicon sensors, taking advantage of…

The high-luminosity upgrade of the CERN LHC requires the replacement of the CMS tracking detector to cope with the increased radiation fluence while maintaining its excellent performance. An extensive R\&D program, aiming at using 3D pixel…

The MALTA family of Depleted Monolithic Active Pixel Sensor (DMAPS) produced in Tower 180 nm CMOS technology targets radiation hard applications for the HL-LHC and beyond. Several process modifications and front-end improvements have…

We have developed a prototype system for the ILC vertex detector based on DEPFET pixels. The system operates a 128x64 matrix (with ~35x25 square micron large pixels) and uses two dedicated microchips, the SWITCHER II chip for matrix…