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The semiconductor industry's rapid advancement pushes conventional two-dimensional technology to its utmost limitations in terms of scaling, performance, and cost factors. These challenges drive the usage of 3D technology in the production…
In this paper, a dynamic (i.e. multi-year) hybrid model is presented for Transmission Expansion Planning (TEP) utilizing the High Voltage Alternating Current (HVAC) and multiterminal Voltage Sourced Converter (VSC)-based High Voltage Direct…
Power efficiency is plateauing in the standard digital electronics realm such that novel hardware, models, and algorithms are needed to reduce the costs of AI training. The combination of energy-based analog circuits and the Equilibrium…
The rapid growth of electric vehicle (EV) adoption poses operational and economic challenges for power distribution systems, including increased line loading levels and network congestions. This may require potential infrastructure…
Memory accounts for a considerable portion of the total power budget and area of digital systems. Furthermore, it is typically the performance bottleneck of the processing units. Therefore, it is critical to optimize the memory with respect…
The semiconductor industry is reaching a fascinating confluence in several evolutionary trends that will likely lead to a number of revolutionary changes in the design, implementation, scaling, and the use of computer systems. However,…
This paper presents a new method for studying electromechanical transients in power systems using three phase, combined transmission and distribution models (hybrid models). The methodology models individual phases of an electric network…
Real-time applications of energy management strategies (EMSs) in hybrid electric vehicles (HEVs) are the harshest requirements for researchers and engineers. Inspired by the excellent problem-solving capabilities of deep reinforcement…
Scalable distributed quantum computing (DQC) has motivated the design of multiple quantum data-center (QDC) architectures that overcome the limitations of single quantum processors through modular interconnection. While these architectures…
Monolithic 3D stackable 1T1C DRAM technology is on the rise, with initial prototypes reported by the industry. This work presents a comprehensive reliability study focusing on the intricate interplay between the row hammer effect and the…
In many modern AI chips and multicore systems-on-chip, embedded applications exhibit predictable inter-core traffic behavior that can be characterized at design time. For such applications, a variety of design-time traffic management and…
With a growing need to enable intelligence in embedded devices in the Internet of Things (IoT) era, secure hardware implementation of Deep Neural Networks (DNNs) has become imperative. We will focus on how to address adversarial robustness…
The number of battery-powered devices is rapidly increasing due to the widespread use of IoT-enabled nodes in various fields. Energy harvesters, which help to power embedded devices, are a feasible alternative to replacing battery-powered…
As SRAM-based caches are hitting a scaling wall, manufacturers are integrating DRAM-based caches into system designs to continue increasing cache sizes. While DRAM caches can improve the performance of memory systems, existing DRAM cache…
To overcome the well-known memory bottleneck of AI chips, 3D stacked architectures that employ advanced packaging technology with high-density through-silicon vias (TSVs) pins have proven to be a promising solution. The 3D-stacked AI chip…
Many convolutional neural network (CNN) accelerators face performance- and energy-efficiency challenges which are crucial for embedded implementations, due to high DRAM access latency and energy. Recently, some DRAM architectures have been…
This work presents (i) a framework for certifying small-signal frequency stability of a power system with line dynamics and heterogeneous bus dynamics, (ii) a novel reduced-order model of damper windings in synchronous machines, and (iii) a…
With recent trend of wearable devices and Internet of Things (IoTs), it becomes attractive to develop hardware-based deep convolutional neural networks (DCNNs) for embedded applications, which require low power/energy consumptions and small…
With the imminent slowing down of DRAM scaling, Phase Change Memory (PCM) is emerging as a lead alternative for main memory technology. While PCM achieves low energy due to various technology-specific advantages, PCM is significantly slower…
Neuromorphic architectures built with Non-Volatile Memory (NVM) can significantly improve the energy efficiency of machine learning tasks designed with Spiking Neural Networks (SNNs). A major source of voltage drop in a crossbar of these…