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Three-dimensional (3D)-stacking technology, which enables the integration of DRAM and logic dies, offers high bandwidth and low energy consumption. This technology also empowers new memory designs for executing tasks not traditionally…
Achieving high performance for sparse applications is challenging due to irregular access patterns and weak locality. These properties preclude many static optimizations and degrade cache performance on traditional systems. To address these…
Main memories play an important role in overall energy consumption of embedded systems. Using conventional memory technologies in future designs in nanoscale era causes a drastic increase in leakage power consumption and temperature-related…
Heterogeneous manycore architectures are the key to efficiently execute compute- and data-intensive applications. Through silicon via (TSV)-based 3D manycore system is a promising solution in this direction as it enables integration of…
Compute-in-memory (PIM) mitigates the memory wall by performing computation within memory, reducing data movement and improving energy efficiency. DRAM-based PIM is particularly attractive due to its high density, mature manufacturing…
Memories that exploit three-dimensional (3D)-stacking technology, which integrate memory and logic dies in a single stack, are becoming popular. These memories, such as Hybrid Memory Cube (HMC), utilize a network-on-chip (NoC) design for…
The influx of non-linear power electronic loads into the distribution network has the potential to disrupt the existing distribution transformer operations. They were not designed to mediate the excessive heating losses generated from the…
With the emergence of Non-Volatile Memories (NVMs) and their shortcomings such as limited endurance and high power consumption in write requests, several studies have suggested hybrid memory architecture employing both Dynamic Random Access…
This article presents a probabilistic modeling method utilizing smart meter data and an innovative agent-based simulator for electric vehicles (EVs). The aim is to assess the effects of different cost-driven EV charging strategies on the…
Over the years, the DRAM latency has not scaled proportionally with its density due to the cost-centric mindset of the DRAM industry. Prior work has shown that this shortcoming can be overcome by reducing the critical length of DRAM access…
With emerging storage-class memory (SCM) nearing commercialization, there is evidence that it will deliver the much-anticipated high density and access latencies within only a few factors of DRAM. Nevertheless, the latency-sensitive nature…
In this paper, we develop a analytical model and algorithm for calculating uneven current distribution in via array structures. We propose a stress time translation formula and cumulative failure distribution equation to model the memory…
3-D integrated circuits (3-D ICs) offer performance advantages due to their increased bandwidth and reduced wire-length enabled by through-silicon-via structures (TSVs). Traditionally TSVs have been considered to improve the thermal…
In this paper, a design space exploration of power delivery networks is performed for multi-chip 2.5-D and 3-D IC technologies. The focus of the paper is the effective placement of the voltage regulator modules (VRMs) for power supply noise…
Reliability is a fundamental requirement in any microprocessor to guarantee correct execution over its lifetime. The design rules related to reliability depend on the process technology being used and the expected operating conditions of…
Energy storage systems (EES) are expected to be an indispensable resource for mitigating the effects on networks of high penetrations of distributed generation in the near future. This paper analyzes the benefits of EES in unbalanced low…
The growing demands of distributed learning on resource constrained edge devices underscore the importance of efficient on device model compression. Tensor Train Decomposition (TTD) offers high compression ratios with minimal accuracy loss,…
The interactions between power, transportation, and information networks (PTIN), are becoming more profound with the advent of smart city technologies. Existing mobile energy storage resource (MESR)-based power distribution network (PDN)…
Network slicing over space division multiplexed elastic optical networks (SDM EONs) enables efficient multiservice provisioning on a shared optical substrate. However, embedding such slices requires coordinated spectrum and compute resource…
Power Delivery Networks (PDNs) are critical for maintaining voltage integrity in modern multiprocessor systems. Conventional early-stage PDN planning relies on static or worst-case power assumptions, often leading to over-provisioned…