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This paper reports on the physical and temperature-dependent electrical characterizations of the oxide/semiconductor interface in MOS capacitors with a SiO2 layer deposited on 4H-SiC using dichlorosilane and nitrogen-based vapor precursors.…

As the size of transistors shrinks and power density increases, thermal simulation has become an indispensable part of the device design procedure. However, existing works for advanced technology transistors use simplified empirical models…

Materials Science · Physics 2025-05-13 Han Xie , Ru Jia , Yonglin Xia , Lei Li , Yue Hu , Jiaxuan Xu , Yufei Sheng , Yuanyuan Wang , Hua Bao

We investigate experimentally the electric transport at the insulating side of the superconductor to insulator transition in thin TiN-films. At temperatures T > 50 mK we observe an Arrhenius-type conductance, with an activation energy…

Superconductivity · Physics 2010-11-18 D. Kalok , A. Bilusic , T. I. Baturina , V. M. Vinokur , C. Strunk

An electrode contact-related mechanism for the operational instability of organic electronic devices is proposed and confirmed via observation of a water-induced change in charge-injection barrier eights at the…

Applied Physics · Physics 2020-01-28 Ryo Nouchi

Resistive switching in amorphous silicon carbide (a-SiC) films deposited by a single composite target magnetron sputtering process is reported. Switching performance as a function of thickness of the films (50, 100 and 300 nm) as well as…

Applied Physics · Physics 2019-08-13 P. Chaitanya Akshara , Nilanjan Basu , Jayeeta Lahiri , G. Rajaram , M. Ghanashyam Krishna

We have fabricated and characterized a field-effect transistor in which an electric field is applied through an encapsulated vacuum cavity and induces a two-dimensional electron system on a hydrogen-passivated Si(111) surface. This vacuum…

Mesoscale and Nanoscale Physics · Physics 2009-11-11 K. Eng , R. N. McFarland , B. E. Kane

Thermal conductivities $\Lambda $ of amorphous carbon thin films are measured in the temperatures range 80--400 K using the $3\omega $ method. Sample films range from soft a-C:H prepared by remote-plasma deposition ($\Lambda = 0.20$ W…

Materials Science · Physics 2009-10-31 Andrew J. Bullen , Keith E. O'Hara , David G. Cahill , Othon Monteiro , Achim von Keudell

High quality optical thin film materials form a basis for on-chip photonic micro- and nano-devices, where several photonic elements form an optical circuit. Their realization generally requires the thin film to have a higher refractive…

We study the heat transfer between weakly coupled systems with flat interface. We present a simple analytical result which can be used to estimate the heat transfer coefficient. As an application we consider the heat transfer between…

Materials Science · Physics 2015-05-19 B. N. J. Persson , H. Ueba

We demonstrated a flexible thermoelectric (TE) sheet based on the longitudinal spin Seebeck effect (LSSE) that is especially suitable for heat-flow sensing applications. This TE sheet contained a Ni0.2Zn0.3Fe2.5O4 film which was formed on a…

This paper reports thermopower and conductivity measurements through the metal-insulator transition for 2-dimensional electron gases in high mobility Si-MOSFETs. At low temperatures both thermopower and conductivity show critical behaviour…

Strongly Correlated Electrons · Physics 2009-11-07 R. Fletcher , V. M. Pudalov , A. D. B. Radcliffe , C. Possanzini

The macroscopic control of ubiquitous heat flow remains poorly explored due to the lack of a fundamental theoretical method. Here, by establishing temperature-dependent transformation thermotics for treating materials whose conductivity…

Materials Science · Physics 2015-11-09 Ying Li , Xiangying Shen , Zuhui Wu , Junying Huang , Yixuan Chen , Yushan Ni , Jiping Huang

An original packaging method suitable for integrated thermal mass flow sensors is presented. The method consists in the application of a plastic transparent adapter to the chip surface. The adapter is sealed to the chip surface by means of…

Other Computer Science · Computer Science 2008-02-22 P. Bruschi , V. Nurra

Modelling heat transfer of carbon nanotubes is important for the thermal management of nanotube-based composites and nanoelectronic device. By using a finite element method for three-dimensional anisotropic heat transfer, we have simulated…

Materials Science · Physics 2015-05-18 Xin-She Yang

We have investigated the thermoelectric and thermal behaviour of Fe-V-W-Al based thin films prepared using radio frequency magnetron sputtering technique at different base pressures (0.1 ~ 1.0 X 10-2 Pa) and on different substrates (n, p…

We present electrical conductance measurements on amorphous NbSi insulating thin films. These films display out-of equilibrium electronic features that are markedly different from what has been reported so far in disordered insulators. Like…

Disordered Systems and Neural Networks · Physics 2014-07-01 Julien Delahaye , Thierry Grenet , C. Marrache-Kikuchi , L. Bergé , A. A. Drillien

BiFeO3 thin films are deposited on FTO coated glass substrates using a simple sol-gel deposition technique, limiting thickness about 70 nm and Ag/BiFeO3/FTO RRAM devices are prepared. The devices showed low-voltage bipolar switching with…

Materials Science · Physics 2018-06-13 Chandni Kumari , Ishan Varun , Shree Prakash Tiwari , Ambesh Dixit

Experiments were performed to study the effects of surface wettability on flow boiling of water at atmospheric pressure. The test channel is a single rectangular channel 0.5 mm high, 5 mm wide and 180 mm long. The mass flux was set at 100…

Fluid Dynamics · Physics 2010-08-30 Hai Trieu Phan , Nadia Caney , Philippe Marty , Stéphane Colasson , Jérôme Gavillet

We perform broadband phase sensitive measurements of the reflection coefficient from 45 MHz up to 20 GHz employing a vector network analyzer with a 2.4 mm coaxial sensor which is terminated by the sample under test. While the material…

Materials Science · Physics 2008-05-12 Elvira Ritz , Martin Dressel

The microelectronics industry is pushing the fundamental limit on the physical size of individual elements to produce faster and more powerful integrated chips. These chips have nanoscale features that dissipate power resulting in nanoscale…

Applied Physics · Physics 2020-11-23 Qilong Cheng , Sukumar Rajauria , Erhard Schreck , Robert Smith , Na Wang , Jim Reiner , Qing Dai , David Bogy