Related papers: CLICTD: A monolithic HR-CMOS sensor chip for the C…
Monolithic Active Pixel Sensors (MAPS) have been developed since the late 1990s based on silicon substrates with a thin epitaxial layer (thickness of 10-15 $\mu$m) in which charge is collected on an electrode, albeit by disordered and slow…
A prototype module for an International Linear Collider (ILC) detector was built, installed, and tested between 2006 and 2009 at CERN and Fermilab as part of the CALICE test beam program, in order to study the possibilities of extending…
The ILD concept, one of two proposed detector concepts for the planned International Linear Collider (ILC), foresees a Time Projection Chamber (TPC) as the main tracking detector. The LCTPC (Linear Collider TPC) collaboration pursues R&D to…
This work presents a depleted monolithic active pixel sensor (DMAPS) prototype manufactured in the LFoundry 150\,nm CMOS process. DMAPS exploit high voltage and/or high resistivity inclusion of modern CMOS technologies to achieve…
The Silicon Charge Detector (SCD) is a subdetector of the High Energy Cosmic Radiation Detection payload. The dynamic range of the silicon microstrip detector can be extended by the capacitive coupling effect, which is related to the…
We discuss the design, fabrication, and testing of prototype horn-coupled, lumped-element kinetic inductance detectors (LEKIDs) designed for cosmic microwave background (CMB) studies. The LEKIDs are made from a thin aluminum film deposited…
Edge-TCT and charge collection measurements with passive test structures made in LFoundry 150 nm CMOS process on p-type substrate with initial resistivity of over 3 k$\Omega$cm are presented. Measurements were made before and after…
This contribution to LCWS2016 presents recent developments within the CLICdp collaboration. An updated scenario for the staged operation of CLIC has been published; the accelerator will operate at 380 GeV, 1.5 TeV and 3 TeV. The lowest…
In high-energy physics, there is a need to investigate alternative silicon sensor concepts that offer cost-efficient, large-area coverage. Sensors based on CMOS imaging technology present such a silicon sensor concept for tracking…
High-voltage CMOS (HV-CMOS) pixel technology is being considered for future Higgs factory experiments. The ATLASPix3.1 chip, with a pitch of 50$\mu m$ x 150$\mu m$, fabricated using TSI 180nm HV-CMOS technology, is a full reticle-size…
Semiconductor pixel detectors offer features for the detection of radiation which are interesting for particle physics detectors as well as for imaging e.g. in biomedical applications (radiography, autoradiography, protein crystallography)…
The STAR Silicon Strip Detector (SSD) completes the three layers of the Silicon Vertex Tracker (SVT) to make an inner tracking system located inside the Time Projection Chamber (TPC). This additional fourth layer provides two dimensional…
Monolithic stitched CMOS sensors are explored for the upgrade of Inner Tracking System of the ALICE experiment (ITS3) and the R&D of the CERN Experimental Physics Department. To learn about stitching, two 26 cm long stitched sensors, the…
Depleted Monolithic Active Pixel Sensor (DMAPS) sensors developed in the Tower Semiconductor 180 nm CMOS imaging process have been designed in the context of the ATLAS ITk upgrade Phase-II at the HL-LHC and for future collider experiments.…
This work presents the design of BUSARD, an application specific integrated circuit (ASIC) for the detection of ionizing particles. The ASIC is a monolithic active pixel sensor which has been fabricated in a High-Voltage…
The ATLAS Semiconductor Tracker (SCT) together with the pixel and the transition radiation detectors will form the tracking system of the ATLAS experiment at LHC. It will consist of 20000 single-sided silicon microstrip sensors assembled…
Silicon photomultipliers (SiPMs) are a good alternative to photomultiplier tubes (PMTs) because their gain and quantum efficiency are comparable to PMTs. However, the largest single-chip SiPM is still less than 1~cm$^2$. In order to use…
Pixel Array Detectors (PADs) consist of an x-ray sensor layer bonded pixel-by-pixel to an underlying readout chip. This approach allows both the sensor and the custom pixel electronics to be tailored independently to best match the x-ray…
The Speedster-EXD is a new 64x64 pixel, 40 $\mu$m pixel pitch, 100 $\mu$m depletion depth hybrid CMOS X-ray detector (HCD) with the capability of reading out only those pixels containing event charge, thus enabling fast effective frame…
The complex system of the CMS all-silicon Tracker, with 15\,148 silicon strip and 1440 silicon pixel modules, requires sophisticated alignment procedures. In order to achieve an optimal track-parameter resolution, the position and…