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Inverse design in photonics has gathered increasing attention as a powerful approach that goes beyond the intuition-based designs. In this Letter, we present the inverse design and experimental demonstration of compact optical cloaks at…
For a system-level design of Networks-on-Chip for 3D heterogeneous System-on-Chip (SoC), the locations of components, routers and vertical links are determined from an application model and technology parameters. In conventional methods,…
As experimental quantum information processing (QIP) rapidly advances, an emerging challenge is to design a scalable architecture that combines various quantum elements into a complex device without compromising their performance. In…
Triply Periodic Minimal Surface (TPMS) structures have emerged as a new class of porous materials with variable geometries and favourable transport properties, making them promising for reactor internals in chemical engineering. However,…
We propose single-step additive fabrication of graded-index optical elements by introducing the light exposure as the additional dimension to three-dimensional (3D) laser writing, hence (3+1)D writing. We use a commercial printer and…
With the soaring demand for high-performing integrated circuits, 3D integrated circuits (ICs) have emerged as a promising alternative to traditional planar structures. Unlike existing 3D ICs that stack 2D layers, a full 3D IC features cubic…
Analysis of three-dimensional biological samples is critical to understanding tissue function and the mechanisms of disease. Many chronic conditions, like neurodegenerative diseases and cancers, correlate with complex tissue changes that…
We present a novel platform of optical tweezers which combines rapid prototyping of user-definable microlens arrays with spatial light modulation (SLM) for dynamical control of each associated tweezer spot. Applying femtosecond direct laser…
We demonstrate electromechanical coupling between a superfluid mechanical mode and a microwave mode formed by a patterned microfluidic chip and a 3D cavity. The electric field of the chip-cavity microwave resonator can be used to both drive…
Graded-index optical elements are capable of shaping light precisely and in very specific ways. While classical freeform optics uses only a two-dimensional domain such as the surface of a lens, recent technological advances in laser…
Growing interest in semiconductor workforce development has generated demand for platforms capable of supporting large numbers of independent hardware designs for research and training without imposing high per-project overhead. Traditional…
Photonic processors use optical signals for computation, leveraging the high bandwidth and low loss of optical links. While many approaches have been proposed, including in memory photonic circuits, most efforts have focused on the physical…
Microstructures, characterized by intricate structures at the microscopic scale, hold the promise of important disruptions in the field of mechanical engineering due to the superior mechanical properties they offer. One fundamental…
Parallel and monolithic 3D integration directions offer pathways to realize 3D integrated circuits (ICs) but still lead to layer-by-layer implementations, each functional layer being composed in 2D first. This mindset causes challenging…
Three-dimensional integrated circuits promise power, performance, and footprint gains compared to their 2D counterparts, thanks to drastic reductions in the interconnects' length through their smaller form factor. We can leverage the…
In the last decades, great achievements have been made in the development of computing machines. However, due to exponential growth of transistor density and in particular due to tremendously increasing power consumption, researchers expect…
Rigorous theories connecting physical properties of a heterogeneous material to its microstructure offer a promising avenue to guide the computational material design and optimization. We present here an efficient Fourier-space based…
Inverse-designed Silicon photonic metastructures offer an efficient platform to perform analog computations with electromagnetic waves. However, due to computational difficulties, scaling up these metastructures to handle a large number of…
Additive manufacturing has become one of the forefront technologies in fabrication, enabling new products impossible to manufacture before. Although many materials exist for additive manufacturing, they typically suffer from performance…
We propose and experimentally demonstrate a photonic routing architecture that can efficiently utilize the space of multi-plane (3D) photonic integration. A wafer with three planes of amorphous silicon waveguides was fabricated and…