Maximizing waveguide integration density with multi-plane photonics
Applied Physics
2017-09-01 v1 Optics
Abstract
We propose and experimentally demonstrate a photonic routing architecture that can efficiently utilize the space of multi-plane (3D) photonic integration. A wafer with three planes of amorphous silicon waveguides was fabricated and characterized, demonstrating dB loss per out-of-plane waveguide crossing, dB per interplane coupler, and microring resonators on three planes with a quality factors up to . We also explore a phase velocity mapping strategy to mitigate the crosstalk between co-propagating waveguides on different planes. These results expand the utility of 3D photonic integration for applications such as optical interconnects, neuromorphic computing and optical phased arrays.
Cite
@article{arxiv.1708.09438,
title = {Maximizing waveguide integration density with multi-plane photonics},
author = {Jeff Chiles and Sonia Buckley and Nima Nader and Sae Woo Nam and Richard P. Mirin and Jeffrey M. Shainline},
journal= {arXiv preprint arXiv:1708.09438},
year = {2017}
}