Related papers: The MAPS-based ITS Upgrade for ALICE
The ATLAS Inner Detector is responsible for particle tracking in ATLAS experiment at CERN Large Hadron Collider (LHC) and comprises silicon and gas based detectors. The combination of both silicon and gas based detectors provides high…
The ATLAS Inner Tracker, the future innermost part of the ATLAS detector, is an all-silicon tracker composed of pixel and strip modules, designed to cope with the extreme conditions expected during High-Luminosity LHC runs. Thorough testing…
While the tracking detectors of the ATLAS and CMS experiments have shown excellent performance in Run 1 of LHC data taking, and are expected to continue to do so during LHC operation at design luminosity, both experiments will have to…
The upcoming ATLAS Phase II upgrade mandates replacing the tracking system with the all-silicon Inner Tracker (ITK), featuring a pixel detector as its core element. The monitoring data of the new system will be aggregated from an…
CLIC is a proposed linear $e^+e^-$ collider with center-of-mass energies of up to 3 TeV. Its main objectives are precise top quark, Higgs boson and Beyond Standard Model physics. In addition to spatial resolutions of a few micrometers and a…
Monolithic Active Pixel Sensors (MAPS) in advanced CMOS imaging technologies are key to next-generation tracking systems for high-energy physics, where radiation hardness and precise vertex reconstruction are essential. As part of the ALICE…
ALICE (A Large Heavy Ion Experiment) is one of the four large scale experiments at the Large Hadron Collider (LHC) at CERN. The High Level Trigger (HLT) is an online computing farm, which reconstructs events recorded by the ALICE detector…
This work presents a depleted monolithic active pixel sensor (DMAPS) prototype manufactured in the LFoundry 150\,nm CMOS process. DMAPS exploit high voltage and/or high resistivity inclusion of modern CMOS technologies to achieve…
In the LHC long shutdown 3, the ALICE experiment upgrades the inner layers of its Inner Tracker System with three layers of wafer-scale stitched sensors bent around the beam pipe. Two stitched sensor evaluation structures, the MOnolithic…
In view of the LHC upgrade for the High Luminosity Phase (HL-LHC), the ATLAS experiment is planning to replace the Inner Detector with an all-Silicon system. The n-in-p bulk technology represents a valid solution for the modules of most of…
The ATLAS experiment at the LHC will replace its current inner tracker system for the HL-LHC era. 3D silicon pixel sensors are being considered as radiation-hard candidates for the innermost layers of the new fully silicon-based tracking…
The measurement of the identified charged hadron p_t spectra using the ITS energy loss signal in the p-p data at sqrt{s}=900 GeV collected by the ALICE experiment at LHC will be discussed. It is performed using the Inner Tracking System…
The foreseen luminosity upgrade for the LHC (a factor of 5-10 more in peak luminosity by 2021) poses serious constraints on the technology for the ATLAS tracker in this High Luminosity era (HL-LHC). In fact, such luminosity increase leads…
The LHCb detector has undergone a major upgrade for LHC Run 3. This Upgrade I detector facilitates operation at higher luminosity and utilises full-detector information at the LHC collision rate, critically including the use of vertex…
During the high-luminosity phase of the LHC (HL-LHC), planned to start around 2027, the accelerator is expected to deliver an instantaneous peak luminosity of up to $7.5\times10^{34}$ cm$^{-2}$s$^{-1}$. A total integrated luminosity of…
The ATLASpix high-voltage monolithic active pixel sensor (HV-MAPS) was designed as a technology demonstrator for the ATLAS ITk Upgrade and the CLIC tracking detector. In this contribution new results from laboratory-based energy calibration…
The tracking detector of ATLAS, one of the experiments at the Large Hadron Collider (LHC), will be upgraded in 2024-2026 to cope with the challenging environment conditions of the High Luminosity LHC (HL-LHC). The LPNHE, in collaboration…
Silicon pixel modules employing n-in-p planar sensors with an active thickness of 200 $\mu$m, produced at CiS, and 100-200 $\mu$m thin active/slim edge sensor devices, produced at VTT in Finland have been interconnected to ATLAS FE-I3 and…
This work presents a depleted monolithic active pixel sensor (DMAPS) prototype manufactured in the LFoundry 150 nm CMOS process. The described device, named LF-Monopix, was designed as a proof of concept of a fully monolithic sensor capable…
We present a method of embedding a Monolithic Active Pixel Sensor (MAPS) into a flexible printed circuit board (FPC) and its interconnection by means of through-hole copper plating. The resulting assembly, baptised "MAPS foil", is a…