Related papers: 3D Integration: Another Dimension Toward Hardware …
3D die stacking and 2.5D interposer design are promising technologies to improve integration density, performance and cost. Current approaches face serious issues in dealing with emerging security challenges such as side channel attacks,…
As with most aspects of electronic systems and integrated circuits, hardware security has traditionally evolved around the dominant CMOS technology. However, with the rise of various emerging technologies, whose main purpose is to overcome…
3D integration offers key advantages in improving system performance and efficiency for the End-of-Scaling era. It enables the incorporation of heterogeneous system components and disparate technologies, eliminates off-chip communication…
3D promises a new dimension in composing systems by aggregating chips. Literally. While the most common uses are still tightly connected with its early forms as a packaging technology, new application domains have been emerging. As the…
Designers use third-party intellectual property (IP) cores and outsource various steps in the integrated circuit (IC) design and manufacturing flow. As a result, security vulnerabilities have been rising. This is forcing IC designers and…
3D integration, i.e., stacking of integrated circuit layers using parallel or sequential processing is gaining rapid industry adoption with the slowdown of Moore's law scaling. 3D stacking promises potential gains in performance, power and…
Not long ago, it was thought that only software applications and general purpose digital systems i.e. computers were prone to various types of attacks against their security. The underlying hardware, hardware implementations of these…
With the globalization of manufacturing and supply chains, ensuring the security and trustworthiness of ICs has become an urgent challenge. Split manufacturing (SM) and layout camouflaging (LC) are promising techniques to protect the…
The globalization of the semiconductor industry has introduced security challenges to Integrated Circuits (ICs), particularly those related to the threat of Hardware Trojans (HTs) - malicious logic that can be introduced during IC…
Split manufacturing (SM) and layout camouflaging (LC) are two promising techniques to obscure integrated circuits (ICs) from malicious entities during and after manufacturing. While both techniques enable protecting the intellectual…
This essay investigates the role of cost in the development and production of secure integrated circuits. Initially, I make a small introduction on hardware attacks on smart cards and some of the reasons behind them. Subsequently, I…
Although it is not a new concept, 3D integration increasingly receives widespread interest and focus as lithographic scaling becomes more challenging, and as the ability to make miniature vias greatly improves. Like Moores law, 3D…
Security and safety are two intertwined terms. It is a common belief that when a place or system is secure, it is safe. This paper shows a means of integrating three devices for physical intrusion detection. This paper thus suggests a means…
In this work, we outline a cross-domain assurance process for safety-relevant software in embedded systems. This process aims to be applied in various different application domains and in conjunction with any development methodology. With…
3D-Integration is a promising technology towards higher interconnect densities and shorter wiring lengths between multiple chip stacks, thus achieving a very high performance level combined with low power consumption. This technology also…
Modern electronic systems become evermore complex, yet remain modular, with integrated circuits (ICs) acting as versatile hardware components at their heart. Electronic design automation (EDA) for ICs has focused traditionally on power,…
As the field of superconducting quantum computing advances from the few-qubit stage to larger-scale processors, qubit addressability and extensibility will necessitate the use of 3D integration and packaging. While 3D integration is…
Modern integrated circuits are essentially two-dimensional (2D). Partial three-dimensional (3D) integration and 3D-transistor-level integrated circuits have long been anticipated as routes to improve the performance, cost and size of…
In the context of hardware trust and assurance, reverse engineering has been often considered as an illegal action. Generally speaking, reverse engineering aims to retrieve information from a product, i.e., integrated circuits (ICs) and…
Many physical plants that are controlled by embedded systems have safety requirements that need to be respected at all times - any deviations from expected behavior can result in damage to the system (often to the physical plant), the…