Related papers: Power-Temperature Stability and Safety Analysis fo…
Virtually all electronic systems try to optimize a fundamental trade-off between higher performance and lower power consumption. The latter becomes critical in mobile computing systems, such as smartphones, which rely on passive cooling.…
Recent embedded systems are designed with high-performance System-on-Chips (SoCs) to satisfy the computational needs of complex applications widely used in real life, such as airplane controllers, autonomous driving automobiles, medical…
The race towards performance increase and computing power has led to chips with heterogeneous and complex designs, integrating an ever-growing number of cores on the same monolithic chip or chiplet silicon die. Higher integration density,…
Mixed-Criticality (MC) systems have recently been devised to address the requirements of real-time systems in industrial applications, where the system runs tasks with different criticality levels on a single platform. In some workloads, a…
In a multiprocessor system on chip (MPSoC) IC the processor is one of the highest heat dissipating devices. The temperature generated in an IC may vary with floor plan of the chip. This paper proposes an integration and thermal analysis…
As processor performance advances, increasing power densities and complex thermal behaviors threaten both energy efficiency and system reliability. This survey covers more than two decades of research on power and thermal modeling and…
As technology scales down, the static power is expected to become a significant fraction of the total power. The exponential dependence of static power with the operating temperature makes the thermal profile estimation of high-performance…
This paper considers the problem of temperature regulation in multicore processors by dynamic voltage-frequency scaling. We propose a feedback law that is based on an integral controller with adjustable gain, designed for fast tracking…
Multi-Processor Systems-on-Chip (MPSoC) can deliver high performance needed in many industrial domains, including aerospace. However, their high power consumption, combined with avionics safety standards, brings new thermal management…
Rapid CMOS device size reduction resulted in billions of transistors on a chip have led to integration of many cores leading to many challenges such as increased power dissipation, thermal dissipation, occurrence of transient faults and…
In modern multi-core Mixed-Criticality (MC) systems, a rise in peak power consumption due to parallel execution of tasks with maximum frequency, specially in the overload situation, may lead to thermal issues, which may affect the…
Modern CPUs with increasing core frequency and power are rapidly reaching a point where the CPU frequency and performance are limited by the amount of heat that can be extracted by the cooling technology. In mobile environment, this issue…
Robustly estimating energy consumption in High-Performance Computing (HPC) is essential for assessing the energy footprint of modern workloads, particularly in fields such as Artificial Intelligence (AI) research, development, and…
General trends in computer architecture are shifting more towards parallelism. Multicore architectures have proven to be a major step in processor evolution. With the advancement in multicore architecture, researchers are focusing on…
In the present paper, the models of structural analysis and evaluation of efficiency indicators (reliability, fault tolerance, viability, and flexibility) of a multi core processor with variable structure, equipped with multi functional…
The consistent demand for better performance has lead to innovations at hardware and microarchitectural levels. 3D stacking of memory and logic dies delivers an order of magnitude improvement in available memory bandwidth. The price paid…
The increase in dissipated power per unit area of electronic components sets higher demands on the performance of the heat sink. Also if we continue at our current rate of miniaturisation, laptops and other electronic devices can get heated…
Using a thermodynamically consistent, mesoscopic model for modern complementary metal-oxide-semiconductor transistors, we study an array of logical circuits and explore how their function is constrained by recent thermodynamic uncertainty…
The management of the energy consumption and thermal dissipation of multi-core heterogeneous platforms is becoming increasingly important as it can have direct impact on the platform performance. This paper discusses an approach that…
We introduce and experimentally validate a new macro-level model of the CPU temperature/power relationship within nanometer-scale application processors or system-on-chips. By adopting a holistic view, this model is able to take into…