Stochastic thermodynamic bounds on logical circuit operation
Abstract
Using a thermodynamically consistent, mesoscopic model for modern complementary metal-oxide-semiconductor transistors, we study an array of logical circuits and explore how their function is constrained by recent thermodynamic uncertainty relations when operating near thermal energies. For a single NOT gate, we find operating direction-dependent dynamics, and a trade-off between dissipated heat and operation time certainty. For a memory storage device, we find an exponential relationship between the memory retention time and energy required to sustain that memory state. For a clock, we find that the certainty in the cycle time is maximized at biasing voltages near thermal energy, as is the trade-off between this certainty and the heat dissipated per cycle. We identify a control mechanism that can increase the cycle time certainty without an offsetting increase in heat dissipation by working at a resonance condition for the clock. These results provide a framework for assessing thermodynamic costs of realistic computing devices, allowing for circuits to be designed and controlled for thermodynamically optimal operation.
Cite
@article{arxiv.2211.00670,
title = {Stochastic thermodynamic bounds on logical circuit operation},
author = {Phillip Helms and Songela W. Chen and David T. Limmer},
journal= {arXiv preprint arXiv:2211.00670},
year = {2025}
}
Comments
8 pages, 4 figures