Related papers: Depleted fully monolithic CMOS pixel detectors usi…
The separation of the data capture and analysis in modern vision systems has led to a massive amount of data transfer between the end devices and cloud computers, resulting in long latency, slow response, and high power consumption.…
The ALICE collaboration is preparing an upgrade of the three innermost layers of the current Inner Tracking System (ITS) during the next LHC long shutdown (LS3). The new ITS detector will use wafer-scale (up to \SI{27}{cm} in length)…
The Inner Tracking System (ITS) of the ALICE experiment at the CERN Large Hadron Collider (LHC) is the largest Monolithic Active Pixel Sensor technology application in high-energy physics. The upgraded version of the tracking system, called…
Results on beam tests of 3D silicon pixel sensors aimed at the ATLAS Insertable-B-Layer and High Luminosity LHC (HL-LHC)) upgrades are presented. Measurements include charge collection, tracking efficiency and charge sharing between pixel…
Combining electrostatic field simulations with Monte Carlo methods enables realistic modeling of the detector response for novel monolithic silicon detectors with strongly non-linear electric fields. Both the precise field description and…
The precise reconstruction of Compton-scatter events is paramount for an imaging medium-energy gamma-ray telescope. The proposed AMEGO-X is enabled by a silicon tracker utilizing AstroPix chips - a pixelated silicon HVCMOS sensor novel for…
An array of DEPFET pixels is one of several concepts to implement an active pixel sensor. Similar to PNCCD and SDD detectors, the typically 0.45 mm thick silicon sensor is fully depleted by the principle of sideward depletion. They have…
The ATLAS Pixel Detector is the innermost layer of the ATLAS tracking system and will contribute significantly to the ATLAS track and vertex reconstruction. The detector consists of identical sensor-chip-hybrid modules, arranged in three…
A monolithic pixel sensor in deep-submicron Silicon-On-Insulator (SOI) CMOS technology has been designed, manufactured and characterised. This technology is of significant interest for applications in particle tracking and imaging. The…
For large scale applications, hybrid pixel detectors, in which sensor and read-out IC are separate entities, constitute the state of the art in pixel detector technology to date. They have been developed and start to be used as tracking…
We report on the experimental study made on a successive prototype of High-Voltage CMOS (HV-CMOS) ATLASPix2 sensor for the tracking detector application, developed with 180 nm feature size. These sensors are to qualify mainly the peripheral…
The ATLAS experiment pixel detector upgrade plans are focused on development of new technology, including the FE-I4 readout integrated circuit. The first upgrade project to make use of this new technology is an "Insertable B-Layer" (IBL)…
For operation at the High Luminosity Large Hadron Collider (LHC), the ATLAS experiment is building a new all-silicon inner tracker (ITk). The production and testing of thousands of silicon pixel and strip modules is required to cover the…
The innermost part of the ATLAS experiment will be a pixel detector containing around 1750 individual detector modules. A detector control system (DCS) is required to handle thousands of I/O channels with varying characteristics. The main…
We report the design and characterization of a CMOS pixel direct charge sensor, Topmetal-II-, fabricated in a standard 0.35um CMOS Integrated Circuit process. The sensor utilizes exposed metal patches on top of each pixel to directly…
We report on the 3-year INFN ATLAS-CMS joint research activity in collaboration with FBK, started in 2014, and aimed at the development of new thin pixel detectors for the High Luminosity LHC Phase-2 upgrades. The program is concerned with…
The upgrade for ATLAS detector will undergo different phase towards super-LHC. The first upgrade for the Pixel detector will consist of the construction of a new pixel layer which will be installed during the first shutdown of the LHC…
Integrated circuits based on CMOS (complementary metal-oxide semiconductors) are at the heart of the technological revolution of the past 40 years, as these have enabled compact and low cost micro-electronic circuits and imaging systems.…
The CMS detector at the CERN LHC features a silicon pixel detector as its innermost subdetector. The original CMS pixel detector has been replaced with an upgraded pixel system (CMS Phase-1 pixel detector) in the extended year-end technical…
The CMS collaboration is building a new inner tracking pixel detector for the High-Luminosity LHC. Each pixel readout chip will be controlled with a single serial input stream at 160 Mbps and will send out data via four current mode logic…