Related papers: Using ECC DRAM to Adaptively Increase Memory Capac…
Content-Addressable Memory (CAM) is a powerful abstraction for building memory caches, routing tables and hazard detection logic. Without a native CAM structure available on FPGA devices, their functionality must be emulated using the…
Die-stacked DRAM has been proposed for use as a large, high-bandwidth, last-level cache with hundreds or thousands of megabytes of capacity. Not all workloads (or phases) can productively utilize this much cache space, however.…
Existing memory reclamation policies on mobile devices may be no longer valid because they have negative effects on the response time of running applications. In this paper, we propose SWAM, a new integrated memory management technique that…
We study the optimal design of heterogeneous Coded Elastic Computing (CEC) where machines have varying computation speeds and storage. CEC introduced by Yang et al. in 2018 is a framework that mitigates the impact of elastic events, where…
Die-stacked DRAM is a promising solution for satisfying the ever-increasing memory bandwidth requirements of multi-core processors. Manufacturing technology has enabled stacking several gigabytes of DRAM modules on the active die, thereby…
Resistive random-access memory (RRAM) is widely recognized as a promising emerging hardware platform for deep neural networks (DNNs). Yet, due to manufacturing limitations, current RRAM devices are highly susceptible to hardware defects,…
Referring Expression Comprehension (REC) aims to localize an image region of a given object described by a natural-language expression. While promising performance has been demonstrated, existing REC algorithms make a strong assumption that…
Embedded RAM blocks (BRAMs) in field programmable gate arrays (FPGAs) are susceptible to single event effects (SEEs) induced by environmental factors such as cosmic rays, heavy ions, alpha particles and so on. As technology scales, the…
Fault tolerance overhead of high performance computing (HPC) applications is becoming critical to the efficient utilization of HPC systems at large scale. HPC applications typically tolerate fail-stop failures by checkpointing. Another…
Over the last three decades, innovations in the memory subsystem were primarily targeted at overcoming the data movement bottleneck. In this paper, we focus on a specific market trend in memory technology: 3D-stacked memory and caches. We…
We study a sequential mechanism design problem in which a principal seeks to elicit truthful reports from multiple rational agents while starting with no prior knowledge of agents' beliefs. We introduce Distributionally Robust Adaptive…
Error correction codes (ECC) are crucial for ensuring reliable information transmission in communication systems. Choukroun & Wolf (2022b) recently introduced the Error Correction Code Transformer (ECCT), which has demonstrated promising…
Raw bit errors are common in NAND flash memory and will increase in the future. These errors reduce flash reliability and limit the lifetime of a flash memory device. We aim to improve flash reliability with a multitude of low-cost…
Many convolutional neural network (CNN) accelerators face performance- and energy-efficiency challenges which are crucial for embedded implementations, due to high DRAM access latency and energy. Recently, some DRAM architectures have been…
Modern multicore processors are employing large last-level caches, for example Intel's E7-8800 processor uses 24MB L3 cache. Further, with each CMOS technology generation, leakage energy has been dramatically increasing and hence, leakage…
Realizing today's cloud-level artificial intelligence functionalities directly on devices distributed at the edge of the internet calls for edge hardware capable of processing multiple modalities of sensory data (e.g. video, audio) at…
Phase Change Memory (PCM) is an attractive candidate for main memory as it offers non-volatility and zero leakage power, while providing higher cell densities, longer data retention time, and higher capacity scaling compared to DRAM. In…
Compute-in-memory (CiM) architectures promise significant improvements in energy efficiency and throughput for deep neural network acceleration by alleviating the von Neumann bottleneck. However, their reliance on emerging non-volatile…
Oblivious RAM (ORAM) is a provable secure primitive to prevent access pattern leakage on the memory bus. It serves as the intermediate layer between the trusted on-chip components and the untrusted external memory systems to modulate the…
Due to the globalization in the semiconductor supply chain, counterfeit dynamic random-access memory (DRAM) chips/modules have been spreading worldwide at an alarming rate. Deploying counterfeit DRAM modules into an electronic system can…