Related papers: MuPix7 - A fast monolithic HV-CMOS pixel chip for …

Depleted Monolithic Active Pixel Sensors (DMAPS) constitute a promising low cost alternative for the outer layers of the ATLAS experiment Inner Tracker (ITk). Realizations in modern, high resistivity CMOS technologies enhance their…

With the ultimate goal of developing a pixel-based readout for a TPC at the ILC, a GridPix readout system consisting of one Timepix3 chip with an integrated amplification grid was embedded in a prototype detector. The performance was…

We demonstrate the application of event-driven Timepix3-based detectors in combination with a double-sided velocity-map-imaging spectrometer to record the full 3D momentum of charged particles at the free-electron-laser facility FLASH. We…

In the context of the Silicon tracking for a Linear Collider (SiLC) R&D collaboration, a highly compact mixed-signal chip has been designed in 130nm CMOS technology intended to read Silicon strip detectors for the experiments at the future…

The DEPFET collaboration develops highly granular, ultra-transparent active pixel detectors for high-performance vertex reconstruction at future collider experiments. The characterization of detector prototypes has proven that the key…

In order to achieve the challenging requirements on the CLIC vertex detector, a range of technology options have been considered in recent years. One prominent idea is the use of active sensors implemented in a commercial high-voltage CMOS…

AstroPix is a high-voltage CMOS (HV-CMOS) monolithic active pixel sensor originally developed to enable precision gamma-ray imaging and spectroscopy in the medium-energy regime (approximately 100 keV-100 MeV) based on the groundwork laid by…

The Speedster-EXD is a new 64x64 pixel, 40 $\mu$m pixel pitch, 100 $\mu$m depletion depth hybrid CMOS X-ray detector (HCD) with the capability of reading out only those pixels containing event charge, thus enabling fast effective frame…

To cope with the challenging environment of the planned high luminosity upgrade of the Large Hadron Collider (HL-LHC), scheduled to start operation in 2029, CMS will replace its entire tracking system. The requirements for the tracker are…

The next generation of MAPS for future tracking detectors will have to meet stringent requirements placed on them. One such detector is the ALICE ITS3 that aims to be very light at 0.07% X/X$_{0}$ per layer and have a low power consumption…

This work presents a depleted monolithic active pixel sensor (DMAPS) prototype manufactured in the LFoundry 150 nm CMOS process. The described device, named LF-Monopix, was designed as a proof of concept of a fully monolithic sensor capable…

We report on the optimization of discharge insensitive floating strip Micromegas (MICRO-MEsh GASeous) detectors, fit for use in high-energy muon spectrometers. The suitability of these detectors for particle tracking is shown in…

This paper presents a high speed and area efficient DWT processor based design for Image Compression applications. In this proposed design, pipelined partially serial architecture has been used to enhance the speed along with optimal…

The timing performance of the Timepix4 application-specific integrated circuit (ASIC) bump-bonded to a $100\;\mu\textrm{m}$ thick n-on-p silicon sensor is presented. A picosecond pulsed infrared laser was used to generate electron-hole…

The performance of the LHCb Muon system and its stability across the full 2010 data taking with LHC running at ps = 7 TeV energy is studied. The optimization of the detector setting and the time calibration performed with the first…

We developed a novel design of a Micro Pixel Chamber ($\mu$-PIC) with resistive electrodes for a charged-particle-tracking detector in high-rate applications. Diamond-Like Carbon (DLC) thin film is used for the cathodes. The resistivity can…

The lack of high power integrated lasers have been limiting silicon photonics. Despite much progress made in chip-scale laser integration, power remains below the level required for key applications. The main inhibiting factor for high…

The radiation hardness of passive CMOS pixel sensors fabricated in 150 nm LFoundry technology is investigated. CMOS process lines are especially of interest for large-scale silicon detectors as they offer high production throughput at…

Small-pitch 3D silicon pixel detectors have been investigated as radiation-hard candidates for the innermost layers of the HL-LHC pixel detector upgrades. Prototype 3D sensors with pixel sizes of 50$\times$50 and 25$\times$100 $\mu$m$^{2}$…

CERN's strategic R&D programme on technologies for future experiments recently started investigating the TPSCo 65nm ISC CMOS imaging process for monolithic active pixels sensors for application in high energy physics. In collaboration with…