Related papers: Thermal analysis of 3D associative processor
Processing-using-DRAM (PUD) is a processing-in-memory (PIM) approach that uses a DRAM array's massive internal parallelism to execute very-wide data-parallel operations, in a single-instruction multiple-data (SIMD) fashion. However, DRAM…
Dynamic programming (DP) algorithms, such as All-Pairs Shortest Path (APSP) and genomic sequence alignment, are fundamental to many scientific domains but are severely bottlenecked by data movement on conventional architectures. While…
A variant of the parallel tempering method is proposed in terms of a stochastic switching process for the coupled dynamics of replica configuration and temperature permutation. This formulation is shown to facilitate the analysis of the…
Emerging workloads, such as graph processing and machine learning are approximate because of the scale of data involved and the stochastic nature of the underlying algorithms. These algorithms are often distributed over multiple machines…
First-principles dynamical CPA (Coherent-Potential Approximation) for electron correlations has been developed further by taking into account higher-order dynamical corrections with use of the asymptotic approximation. The theory is applied…
Analysis of three-particle correlations is performed on the basis of simulation data of atomic dynamics in liquid and amorphous aluminium. A three-particle correlation function is introduced to characterize the relative positions of various…
The stability ofthe proportional--integral--derivative (PID)controlof temperature in the spark plasma sintering (SPS) process is investigated.ThePID regulationsof this process are tested fordifferent SPS toolingdimensions, physical…
Processing-in-memory (PIM) has emerged as the go to solution for addressing the von Neumann bottleneck in edge AI accelerators. However, state-of-the-art (SoTA) digital PIM approaches suffer from low compute density, primarily due to the…
Addressing the uncertainty and variability in the quality of 3D printed metals can further the wide spread use of this technology. Process mapping for new alloys is crucial for determining optimal process parameters that consistently…
Large language models (LLMs) exhibit memory-intensive behavior during decoding, making it a key bottleneck in LLM inference. To accelerate decoding execution, hybrid-bonding-based 3D-DRAM has been adopted in LLM accelerators. While this…
For warm and hot dense plasma (WHDP), the ionization potential depression (IPD) is a key physical parameter in determining its ionization balance, therefore a reliable and universal IPD model is highly required to understand its microscopic…
We revisit the metastability properties of the mixed p-spin spherical disordered models. Firstly, using known methods, we show that there is temperature chaos in a broad range of temperatures. Secondly, we modify the definition of the…
Galliumnitride has become a strategic superior material for space, defense and civil applications, primarily for power amplification at RF and mm-wave frequencies. For AlGaN/GaN high electron mobility transistors (HEMT), an outstanding…
Modern package designs make use of technologies such as backside power delivery (BSPD) and 3D stacked chiplets that require accounting for the heterogeneity in back end of the line (BEOL) structures in hot-spot prediction. Multiscale…
Cryogenic microsystems that utilize different 3D integration techniques are being actively developed, e.g., for the needs of quantum technologies. 3D integration can introduce opportunities and challenges to the thermal management of low…
Most previous 3D IC research focused on stacking traditional 2D silicon layers, so the interconnect reduction is limited to inter-block delays. In this paper, we propose techniques that enable efficient exploration of the 3D design space…
We explore different ways to simplify the evaluation of the smooth overlap of atomic positions (SOAP) many-body atomic descriptor [Bart\'{o}k et al., Phys. Rev. B 87, 184115 (2013)]. Our aim is to improve the computational efficiency of…
The rapid growth of AI and accelerator-driven workloads is forcing a fundamental rethinking of optical interconnect architectures in datacenters. Co-packaged optics and three-dimensional photonic integration have emerged as promising…
Today's systems are overwhelmingly designed to move data to computation. This design choice goes directly against at least three key trends in systems that cause performance, scalability and energy bottlenecks: (1) data access from memory…
This paper introduces a fast Central Processing Unit (CPU) implementation of geodesic morphological operations using stream processing. In contrast to the current state-of-the-art, that focuses on achieving insensitivity to the filter sizes…