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This study investigates a high Q-factor spiral inductor fabricated by the CMOS (complementary metal oxide semiconductor) process and a post-process. The spiral inductor is manufactured on silicon substrate using the 0.35 micrometers CMOS…
Active pixel sensors based on the High-Voltage CMOS technology are being investigated as a viable option for the future pixel tracker of the ATLAS experiment at the High-Luminosity LHC. This paper reports on the testbeam measurements…
For the CLIC two-beam scheme, a high-current, long-pulse drive beam is required for RF power generation. Taking advantage of the 3 GHz klystrons available at the LEP injector once LEP stops, a 180 MeV electron accelerator is being…
We present the design and the test results of a dual-channel Vertical-Cavity Surface-Emitting Laser (VCSEL) driver ASIC LOCld65 for detector front-end readout. LOCld65 is designed in a commercial 65-nm CMOS technology with a power supply of…
We present an active quenching application specific integrated circuit (ASIC), for use in conjunction with InGaAs/InP avalanche photodiodes (APDs), for 1550 nm single-photon detection. To evaluate its performance, we first compare its…
Monolithic Active Pixel Sensors (MAPS) in advanced CMOS imaging technologies are key to next-generation tracking systems for high-energy physics, where radiation hardness and precise vertex reconstruction are essential. As part of the ALICE…
The need for a high-performance transceiver with high Signal to Noise Ratio (SNR) has driven the communication system to utilize the latest technique identified as oversampling systems. It was the most economical modulator and decimation in…
Digital accelerators in the latest generation of CMOS processes support multiply and accumulate (MAC) operations at energy efficiencies spanning 10-to-100~fJ/Op. But the operating speed for such MAC operations are often limited to a few…
The ALICE experiment will upgrade the innermost three layers of its vertexing detector, the Inner Tracking System (ITS), during the next LHC Long Shutdown (LS3) with a novel, bent, ultra-light MAPS-based tracker. Six wafer-scale sensor…
Silicon pixel modules employing n-in-p planar sensors with an active thickness of 200 $\mu$m, produced at CiS, and 100-200 $\mu$m thin active/slim edge sensor devices, produced at VTT in Finland have been interconnected to ATLAS FE-I3 and…
The drastic increase of bandwidth demands in AI datacenters requires new solutions with low power consumption and high bandwidth densities. Further increasing the total bandwidth with copper interconnects is challenging, thus it is crucial…
Scientific detectors are a key technological enabler for many disciplines. Application-specific integrated circuits (ASICs) are used for many of these scientific detectors. Until recently, pixel detector ASICs have been used mainly for…
Multiple controllable spiking patterns are obtained in a 1310 nm Vertical Cavity Surface Emitting Laser (VCSEL) in response to induced perturbations and for two different cases of polarized optical injection, namely parallel and orthogonal.…
In the context of the CERN EP R&D on monolithic sensors and the ALICE ITS3 upgrade, the Tower Partners Semiconductor Co (TPSCo) 65 nm process has been qualified for use in high energy physics, and adopted for the ALICE ITS3 upgrade. An…
We introduce multijunction active layers, featuring a stack of alternating active layers and tunnel junctions, to PCSELs to increase their slope efficiency, which is vital for various applications including laser processing and LiDAR.…
We present the design and test results of a 4-channel 10-Gbps/ch Vertical-Cavity Surface-Emitting Laser array driver, the cpVLAD. With on-chip charge-pumps to extend the biasing headroom for the VCSELs needed for low temperature operation…
Following the Phase-II upgrade during Long Shutdown (LS3), the LHC aims to reach a peak instantaneous luminosity of $7.5\times 10^{34}$cm$^{-2}$s$^{-1}$, which corresponds to an average of around 200 inelastic proton-proton collisions per…
- This paper describes a pipeline analog-to-digital converter is implemented for high speed camera. In the pipeline ADC design, prime factor is designing operational amplifier with high gain so ADC have been high speed. The other advantage…
The Inner Tracking System (ITS) of the ALICE experiment at CERN will undergo an upgrade during the LHC long shutdown 3, in which the three innermost tracking layers will be replaced. This upgrade, named the Inner Tracking System 3 (ITS3),…
This paper focuses on the simulation of multi-die System-on-Chip (SoC) architectures using VisualSim, emphasizing chiplet-based system modeling and performance analysis. Chiplet technology presents a promising alternative to traditional…