Related papers: A Novel Methodology for Thermal Analysis & 3-Dimen…
As conventional technology scaling approaches physical and power limitations, modern computing systems increasingly face performance bottlenecks arising from memory latency, energy consumption, scalability constraints, and data movement…
As processor performance advances, increasing power densities and complex thermal behaviors threaten both energy efficiency and system reliability. This survey covers more than two decades of research on power and thermal modeling and…
Monolithic three-dimensional integration of memory and logic circuits could dramatically improve performance and energy efficiency of computing systems. Some conventional and emerging memories are suitable for vertical integration,…
Power consumption and heat dissipation become key elements in the field of high-end integrated circuits, especially those used in mobile and high-speed applications, due to their increase of transistor count and clock frequencies. Dynamic…
The rapid advancement of neuromorphic technology aims to address the memory wall challenge inherent in conventional von Neumann architectures. This paper critically examines current digital neuromorphic processors and their strategies to…
Accurate knowledge of temperatures in power semiconductor modules is crucial for proper thermal management of such devices. Precise prediction of temperatures allows to operate the system at the physical limit of the device avoiding…
This work builds on the previous introduction [1] of a coupled experimental-computational system devised to fully characterize the thermal behavior of complex 3D submicron electronic devices. The new system replaces the laser-based surface…
The speed of modern digital systems is severely limited by memory latency (the ``Memory Wall'' problem). Data exchange between Logic and Memory is also responsible for a large part of the system energy consumption. Logic--In--Memory (LiM)…
Memory-centric computing aims to enable computation capability in and near all places where data is generated and stored. As such, it can greatly reduce the large negative performance and energy impact of data access and data movement, by…
Leveraging the latent heat of phase change materials (PCMs) can reduce the peak temperatures and transient variations in temperature in electronic devices. But as the power levels increase, the thermal conduction pathway from the heat…
Thermal density and hot spots limit three-dimensional (3D) implementation of massively-parallel SIMD processors and prohibit stacking DRAM dies above them. This study proposes replacing SIMD by an Associative Processor (AP). AP exhibits…
The race towards performance increase and computing power has led to chips with heterogeneous and complex designs, integrating an ever-growing number of cores on the same monolithic chip or chiplet silicon die. Higher integration density,…
As technology scales down, the static power is expected to become a significant fraction of the total power. The exponential dependence of static power with the operating temperature makes the thermal profile estimation of high-performance…
We survey the current state of phase change memory (PCM), a non-volatile solid-state memory technology built around the large electrical contrast between the highly-resistive amorphous and highly-conductive crystalline states in so-called…
Computing has a huge memory problem. The memory system, consisting of multiple technologies at different levels, is responsible for most of the energy consumption, performance bottlenecks, robustness problems, monetary cost, and hardware…
Manycore SoC architectures based on on-chip shared memory are preferred for flexible and programmable solutions in many application domains. However, the development of many ported memory is becoming increasingly challenging as we approach…
In recent years, the energy consumption of computing systems has increased and a large fraction of this energy is consumed in main memory. Towards this, researchers have proposed use of non-volatile memory, such as phase change memory…
Main memory's rising energy consumption has emerged as a critical challenge in modern computing architectures, particularly in large-scale systems, driven by frequent access patterns, growing data volumes, and insufficient power management…
The process of numerical thermalization in particle-in-cell (PIC) simulations has been studied extensively. It is analogous to Coulomb collisions in real plasmas, causing particle velocity distributions (VDFs) to evolve towards a Maxwellian…
Over the past two decades, the storage capacity and access bandwidth of main memory have improved tremendously, by 128x and 20x, respectively. These improvements are mainly due to the continuous technology scaling of DRAM (dynamic…