Related papers: Integrated Circuit Readout for the Silicon Sensor …
The CMS experiment at the CERN LHC will be upgraded to accommodate the 5-fold increase in the instantaneous luminosity expected at the High-Luminosity LHC (HL-LHC). Concomitant with this increase will be an increase in the number of…
The CMS silicon tracker consists of two tracking devices utilizing semiconductor technology: the inner pixel and the outer strip detectors. They operate in a high-occupancy and high-radiation environment presented by particle collisions in…
The tracking system of the CMS experiment, currently under construction at the Large Hadron Collider (LHC) at CERN (Geneva, Switzerland), will include a silicon pixel detector providing three spacial measurements in its final configuration…
In a multiprocessor system on chip (MPSoC) IC the processor is one of the highest heat dissipating devices. The temperature generated in an IC may vary with floor plan of the chip. This paper proposes an integration and thermal analysis…
Arrays of low-temperature microcalorimeters provide a promising technology for X-ray astrophysics: the imaging spectrometer. A camera with at least several thousand pixels, each of which has an energy-resolving power ($E/\Delta…
In order to achieve the challenging requirements on the CLIC vertex detector, a range of technology options have been considered in recent years. One prominent idea is the use of active sensors implemented in a commercial high-voltage CMOS…
A detector concept based on hybrid planar pixel-detector technology is under development for the CLIC vertex detector. It comprises fast, low-power and small-pitch readout ASICs implemented in 65 nm CMOS technology (CLICpix) coupled to…
High-voltage CMOS (HV-CMOS) pixel technology is being considered for future Higgs factory experiments. The ATLASPix3.1 chip, with a pitch of 50$\mu m$ x 150$\mu m$, fabricated using TSI 180nm HV-CMOS technology, is a full reticle-size…
Electron spins in silicon quantum dots provide a promising route towards realising the large number of coupled qubits required for a useful quantum processor. At present, the requisite single-shot spin qubit measurements are performed using…
A new tracking detector will be installed as part of the Phase-2 upgrade of the CMS detector for the high-luminosity LHC era. This tracking detector includes the Inner Tracker, equipped with silicon pixel sensor modules, and the Outer…
With over 200 square meters of sensitive Silicon and almost 10 million readout channels, the Silicon Strip Tracker of the CMS experiment at the LHC will be the largest Silicon strip detector ever built. The design, construction and expected…
The physics aims at the proposed future high-energy linear $e^+e^-$ collider CLIC pose challenging demands on the performance of the detector system. In particular, the vertex and tracking detectors have to combine a spatial resolution of a…
We have operated a Medipix2 CMOS readout chip, with amplifying, shaping and charge discriminating front-end electronics integrated on the pixel-level, as a highly segmented direct charge collecting anode in a three-stage gas electron…
Pixel sensors based on commercial high-voltage CMOS processes are an exciting technology that is considered as an option for the outer layer of the ATLAS inner tracker upgrade at the High Luminosity LHC. Here, charged particles are detected…
3D silicon detectors are characterized by cylindrical electrodes perpendicular to the surface and penetrating into the bulk material in contrast to standard Si detectors with planar electrodes on its top and bottom. This geometry renders…
As photonics breaks away from today's device level toward large scale of integration and complex systems-on-a-chip, concepts like monitoring, control and stabilization of photonic integrated circuits emerge as new paradigms. Here, we show…
A prototype of the CMOS pixel sensor named SUPIX-1 has been fabricated and tested in order to investigate the feasibility of a pixelated tracker for a proposed Higgs factory, namely, the Circular Electron-Positron Collider (CEPC). The…
The STS-MUCH-XYTER (SMX) chip is a front-end ASIC dedicated to the readout of Silicon Tracking System (STS) and Muon Chamber (MUCH) detectors in the Compressed Baryonic Matter (CBM) experiment. The production of the ASIC and the front-end…
CLIC is a proposed linear e+e- collider designed to provide particle collisions at center-of-mass energies of up to 3 TeV. Precise measurements of the properties of the top quark and the Higgs boson, as well as searches for Beyond the…
The design, construction and performance of the H1 silicon vertex detector is described. It consists of two cylindrical layers of double sided, double metal silicon sensors read out by a custom designed analog pipeline chip. The analog…