Related papers: Sensor/ROIC Integration using Oxide Bonding
Haptic feedback is important to make robots more dexterous and effective in unstructured environments. High-resolution haptic sensors are still not widely available, and their application is often bound by the resolution-robustness dilemma.…
Low temperature covalent direct wafer-wafer bonding allows for the fusion of multiple semiconductor wafers without any additional material at the bonding interface. In the context of particle pixel detectors this might provide an…
Absorption spectroscopy is widely used in sensing and astronomy to understand molecular compositions on microscopic to cosmological scales. However, typical dispersive spectroscopic techniques require multichannel detection, fundamentally…
We present an approach to fabrication and packaging of integrated photonic devices that utilizes waveguide and detector layers deposited at near-ambient temperature. All lithography is performed with a 365 nm i-line stepper, facilitating…
Realizing reversible reduction-oxidation (Redox) reactions of lattice oxygen in batteries is a promising way to improve the energy and power density. However, conventional oxygen absorption spectroscopy fails to distinguish the critical…
Actively tunable photonic devices are vital for next-generation optoelectronics requiring rapid switching and high bandwidth. Although organic optoelectronic devices have found wide application, their use as optical modulators has been…
Cryogenics is a pivotal aspect in the development of quantum technologies. Closed-cycle devices have recently emerged as an environmentally friendly and low-maintenance alternative to liquid helium cryostats. Yet the larger level of…
Zero-index materials exhibit exotic optical properties that can be utilized for integrated-optics applications. However, practical implementation requires compatibility with complementary metallic-oxide-semiconductor (CMOS) technologies. We…
A reliable and cost-effective interconnect technology is required for the development of hybrid pixel detectors. The interconnect technology needs to be adapted for the pitch and die sizes of the respective applications. For small-scale…
Boosting the sensitivity of solid-state gas sensors by incorporating nanostructured materials as the active sensing element can be complicated by interfacial effects. Interfaces at nanoparticles, grains, or contacts may result in non-linear…
The development of graphene electronics requires the integration of graphene devices with Si-CMOS technology. Most strategies involve the transfer of graphene sheets onto silicon, with the inherent difficulties of clean transfer and…
This paper presents a new optical integrated sensing and communication (O-ISAC) framework tailored for cost-effective Light-Emitting Diode (LED) for enhanced Internet of Things (IoT) applications. Unlike prior research on ISAC, which…
Iontronics combines ions as charge carriers with electronic-like operations, enabling unique information processing, chemical regulation, and enhanced bio-integrability. Standard simulation tools encounter difficulties in effectively…
Future wireless networks will integrate sensing, learning and communication to provide new services beyond communication and to become more resilient. Sensors at the network infrastructure, sensors on the user equipment, and the sensing…
Electrokinetic phenomena at polymer-water interfaces are central to technologies for water purification, ion separations, and energy conversion, yet the ability to systematically control polymer surface charge and associated electrokinetic…
Metal-oxide sensors are widely used due to their sensitivities to different types of gaseous, and these sensors are suitable for long-term applications, even in the presence of corrosive environments. However, the microscopic mechanisms…
We report on fabrication of a microtoroid resonator of a high-quality factor (i. e., Q-factor of ~3.24x10^6 measured under the critical coupling condition) integrated in a microfluidic channel using femtosecond laser three-dimensional (3D)…
Resonant inelastic X-ray scattering (RIXS) and X-ray absorption (XA) experiments at the iron L- and nitrogen K-edge are combined with high-level first principles restricted active space self-consistent field (RASSCF) calculations for a…
The timing performance of silicon sensors bump-bonded to Timepix3 ASICs is investigated, prior to and after different types of irradiation up to $8 \times 10^{15} 1 \mathrm{\,Me\kern -0.1em V} \mathrm{ \,n_{eq}} {\mathrm{ \,cm}}^{-2}$. The…
Integrated sensing and communication (ISAC) has emerged as a key technological paradigm for sixth generation (6G) mobile networks, aiming to unify sensing and communication in a spectrally efficient and hardware lightweight manner. Radio…