Related papers: Development of Vertically Integrated Circuits for …

Pixel detectors for precise particle tracking in high energy physics have been developed to a level of maturity during the past decade. Three of the LHC detectors will use vertex detectors close to the interaction point based on the hybrid…

Visible light communication (VLC) based localization is a potential candidate for wide range indoor localization applications. In this paper, we propose a VLC architecture based on orthogonal frequency division multiplexing (OFDM) with…

Providing high data rates is one of the big concerns in visible light communication (VLC) systems. This paper introduces a data centre design that use a VLC system for downlink communication. In this work, RYGB laser diodes (LD) are used as…

The results of the BTeV silicon pixel detector beam test carried out at Fermilab in 1999-2000 are reported. The pixel detector spatial resolution has been studied as a function of track inclination, sensor bias, and readout threshold.

The design, construction and performance of the H1 silicon vertex detector is described. It consists of two cylindrical layers of double sided, double metal silicon sensors read out by a custom designed analog pipeline chip. The analog…

In 2019 the Belle II experiment started data taking at the asymmetric SuperKEKB collider (KEK, Japan) operating at the Y(4S) resonance. Belle II will search for new physics beyond the Standard Model by collecting an integrated luminosity of…

In the transition to Run 3 in 2021, LHCb will undergo a major luminosity upgrade, going from 1.1 to 5.6 expected visible Primary Vertices (PVs) per event, and will adopt a purely software trigger. This has fueled increased interest in…

The SiD Detector is one of two detector designs for the future International Linear Collider (ILC) that were validated in 2012 SiD features a compact, cost-constrained design for precision Higgs and other measurements, and sensitivity to a…

The on-detector optical link of the ATLAS pixel detector contains radiation-hard receiver chips to decode bi-phase marked signals received on PIN arrays and data transmitter chips to drive VCSEL arrays. The components are mounted on hybrid…

Traditional photonic integrated circuit (PIC) inherits the mature CMOS fabrication process from the electronic integrated circuit (IC) industry. However, this process also limits the PIC structure to a single-waveguide-layer configuration.…

The LHC is expected to reach luminosities up to 3000fb-1 and the innermost layer of the ATLAS upgrade plans to cope with higher occupancy and to decrease the pixel size. 3D-Si sensors are a good candidate for the innermost layer of the…

Comprehending the unique characteristics of structured ultrafast optical pulses is essential to the physics, applications and instrumentations of ultrafast lasers. However, full-vectrorial characterizations of the pulses remain challenging…

We present 3D Particle-in-Cell (PIC) modeling of an ultra-intense laser experiment by the Extreme Light group at the Air Force Research Laboratory (AFRL) using the PIC code LSP. This is the first time PIC simulations have been performed in…

Owing to their intrinsic (geometry dependent) radiation hardness, 3D pixel sensors are promising candidates for the innermost tracking layers of the forthcoming experiment upgrades at the Phase 2 High-Luminosity LHC (HL-LHC). To this…

We characterized the front-end electronics used to process high-frequency signals from low-gain avalanche diodes (LGADs) at the Fermilab Test Beam Facility. LGADs are silicon detectors employed for charged particle tracking, offering…

In view of the LHC upgrade phases towards the High Luminosity LHC (HL-LHC), the ATLAS experiment plans to upgrade the Inner Detector with an all-silicon system. The n-on-p silicon technology is a promising candidate to achieve a large area…

The concept of capacitive coupling between sensors and readout chips is under study for the vertex detector at the proposed high-energy CLIC electron positron collider. The CLICpix Capacitively Coupled Pixel Detector (C3PD) is an active…

The ATLAS Forward Physics (AFP) project plans to install 3D silicon pixel detectors about 210 m away from the interaction point and very close to the beamline (2-3 mm). This implies the need of slim edges of about 100-200 $\mu$m width for…

In next ten years, the Large Hadron Collider will be upgraded to the High Luminosity LHC (HL-LHC), resulting in ten time more integrated luminosity. To withstand the much harsher radiation and occupancy conditions of the HL-LHC, the inner…

Three-dimensional (3D) CMOS technology encourages the use of UV laser annealing (UV-LA) because the shallow absorption of UV light into materials and the process timescale typically from nanoseconds (ns) to microseconds (us) strongly limit…