Related papers: Development of Vertically Integrated Circuits for …

We develop the vertex detector for the international linear collider (ILC) using the FPCCD (Fine Pixel CCD), whose pixel size is 5 x 5 um2. Together with the FPCCD sensor, a prototype of the readout ASIC was developed in 2008. The readout…

This paper reports a method allowing for the determination of the shape of deformed fiber-like objects. Compared to existing methods, it provides analytical results including the local slope and curvature which are of first importance, for…

Fermilab's Integrable Optics Test Accelerator is an electron storage ring designed for testing advanced accelerator physics concepts, including implementation of nonlinear integrable beam optics and experiments on optical stochastic…

Entanglement is a counterintuitive feature of quantum physics that is at the heart of quantum technology. High-dimensional quantum states offer unique advantages in various quantum information tasks. Integrated photonic chips have recently…

Visible Light Communication (VLC) has gained great interest in the last decade due to the rapid developments in Light Emitting Diodes (LEDs) fabrication. Efficiency, durability and long life span of LEDs make them a promising residential…

Results on beam tests of 3D silicon pixel sensors aimed at the ATLAS Insertable-B-Layer and High Luminosity LHC (HL-LHC)) upgrades are presented. Measurements include charge collection, tracking efficiency and charge sharing between pixel…

The growing demand for location-based services in areas like virtual reality, robot control, and navigation has intensified the focus on indoor localization. Visible light positioning (VLP), leveraging visible light communications (VLC),…

Over the past few years we have developed, in collaboration with the SARNOFF Corporation, a design of a Monolithic CMOS Pixel Detector for ILC Vertex Detectors. The unique feature of this design is that each hit is accompanied by a time tag…

We report on the 3-year INFN ATLAS-CMS joint research activity in collaboration with FBK, started in 2014, and aimed at the development of new thin pixel detectors for the High Luminosity LHC Phase-2 upgrades. The program is concerned with…

A study of 3D pixel sensors of cell size 50 {\mu}m x 50 {\mu}m fabricated at IMB-CNM using double-sided n-on-p 3D technology is presented. Sensors were bump-bonded to the ROC4SENS readout chip. For the first time in such a small-pitch…

During LHC Long Shutdown 3, the ALICE experiment will replace the three innermost layers of its Inner Tracking System (ITS2) with a new vertex detector, the ITS3. This new detector will be assembled using wafer-scale, stitched Monolithic…

The development of CMOS pixel sensors with column parallel read-out and integrated zero-suppression has resulted in a full size, nearly 1 Megapixel, prototype with ~100 \mu s read-out time. Its performances are quite close to the ILD vertex…

CMOS Pixel Sensors are making steady progress towards the specifications of the ILD vertex detector. Recent developments are summarised, which show that these devices are close to comply with all major requirements, in particular the…

Recent interest in exploring local vacuum structure of QCD through the properties of the eigenmodes of the lattice Dirac operators rises again the challenge to visualize four-dimensional objects and structures which appear in lattice field…

We present the first beam test results with centimeter-scale AC-LGAD strip sensors, using the Fermilab Test Beam Facility and sensors manufactured by the Brookhaven National Laboratory. Sensors of this type are envisioned for applications…

In order to fully exploit the physics potential of a e+e- linear collider, such as TESLA, a Vertex Tracker providing high resolution track reconstruction is required. Hybrid Silicon pixel sensors are an attractive sensor technology option…

Efficient coupling of III-V light sources to silicon photonic circuits is one of the key challenges of integrated optics. Important requirements are low coupling losses, as well as small footprint and high yield of the overall assembly,…

3D-Integration is a promising technology towards higher interconnect densities and shorter wiring lengths between multiple chip stacks, thus achieving a very high performance level combined with low power consumption. This technology also…

A significant upgrade of the LHCb detector is scheduled to be installed in 2018-2019. Afterwards all sub-detectors will be read out at the LHC bunch crossing frequency of 40 MHz and the trigger will be fully implemented in software. The…

The silicon pixel vertex detector is a key element of the BTeV spectrometer. Sensors bump-bonded to prototype front-end devices were tested in a high energy pion beam at Fermilab. The spatial resolution and occupancies as a function of the…