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Designer heterostructures can now be assembled layer-by-layer with unmatched precision thanks to the recently developed deterministic placement methods to transfer two-dimensional (2D) materials. This possibility constitutes the birth of a…
Next-generation electronics calls for new materials beyond silicon for increased functionality, performance, and scaling in integrated circuits. Carbon nanotubes and semiconductor nanowires are at the forefront of these materials, but have…
The iterative prototyping process for printed circuit boards (PCBs) frequently employs surface-mounted device (SMD) components, which are often discarded rather than reused due to the challenges associated with desoldering, leading to…
Starting from graphene, 2D layered materials family has been recently set up more than 100 different materials with variety of different class of materials such as semiconductors, metals, semimetals, superconductors. Among these materials,…
CMOS Image Sensors are experiencing significant growth due to their capabilities to be integrated in smartphones with refined image quality. One of the major contributions to the growth of image sensors is the innovation brought about in…
This paper describes a novel integrated circuit technology to manufacture high-density thermoelectric devices on a semiconductor wafer. With no moving parts, a thermoelectric cooler operates quietly, allows cooling below ambient…
Heterostructure materials form the basis of much of modern electronics, from transistors to lasers and light-emitting diodes. Recent years have seen a renewed focus on creating heterostructures through the vertical integration of…
Tensor decomposition has proven to be a strong tool in various 3D image processing tasks such as denoising and super-resolution. In this context, we recently proposed a canonical polyadic decomposition (CPD) based algorithm for single image…
The deep trapping gate pixel device was described recently as an alternative to CMOS 3T pixel. The feasibilty of this device was studied with technological and transport simulations used in classical electron devices and process design. A…
We present a novel transparent conductive support structure for two-dimensional (2D) materials that provides an electronically passive 2D/3D interface while also enabling facile interfacial charge transport. This structure, which comprises…
Assembling atomic layers of van der Waals materials (vdW) combines the physics of two materials, offering opportunities for novel functional devices. Realization of this has been possible because of advancements in nanofabrication processes…
Ceramics are highly technical materials with properties of interest for multiple industries. Precisely because of their high chemical, thermal, and mechanical resistance, ceramics are difficult to mold into complex shapes. A possibility to…
Camera and LiDAR sensor modalities provide complementary appearance and geometric information useful for detecting 3D objects for autonomous vehicle applications. However, current end-to-end fusion methods are challenging to train and…
Engineering simulations are usually based on complex, grid-based, or mesh-free methods for solving partial differential equations. The results of these methods cover large fields of physical quantities at very many discrete spatial…
The growth of two-dimensional (2D) transition metal dichalcogenides using chemical vapor deposition has been an area of intense study, primarily due to the scalability requirements for potential device applications. One of the major…
Dielectrics are insulating materials used in many different electronic devices and play an important role in all of them. Current advanced electronic devices use dielectric materials with a high dielectric constant and avoid high leakage…
Depth images have a wide range of applications, such as 3D reconstruction, autonomous driving, augmented reality, robot navigation, and scene understanding. Commodity-grade depth cameras are hard to sense depth for bright, glossy,…
Pristine van der Waals (vdW) interfaces between two-dimensional (2D) and other materials are core to emerging optical and electronic devices. Their direct fabrication is, however, challenged as the vdW forces are weak and cannot be tuned to…
We have previously introduced Spectral Diffusion Posterior Sampling (Spectral DPS) as a framework for accurate one-step material decomposition by integrating analytic spectral system models with priors learned from large datasets. This work…
Consumer-level multi-material 3D printing with conductive thermoplastics enables fabrication of interactive elements for bespoke tangible devices. However, large feature sizes, high resistance materials, and limitations of printable control…