Related papers: Copper Electrodeposition for 3D Integration
A decade ago, two-dimensional microscopic flow visualization proved the theoretically predicted existence of electroconvection roles as well as their decisive role in destabilizing the concentration polarization layer at ion-selective…
Two-dimensional (2D) transition metal dichalcogenides are pivotal for next-generation photonic devices due to their exceptional optical properties and strong light-matter interactions. However, their atomic thinness renders them susceptible…
Infrared and visible image fusion aims to generate synthetic images simultaneously containing salient features and rich texture details, which can be used to boost downstream tasks. However, existing fusion methods are suffering from the…
Transfer and integration of nanostructures onto target substrates is the prerequisite for their fundamental studies and practical applications. Conventional transfer techniques that involve stamping, lift-off and/or striping suffer from the…
The advancement of concrete 3D printing (C3DP) technology has revolutionized the construction industry, offering unique opportunities for innovation and efficiency. At the heart of this process lies a comprehensive digital chain that…
Nowadays is very common to find headlines in the media where it is stated that 3D printing is a technology called to change our lives in the near future. For many authors, we are living in times of a third industrial revolution. Howerver,…
Two-dimensional (2D) transition metal dichalcogenides (TMDCs) with unique electrical properties are fascinating materials used for future electronics. However, the strong Fermi level pinning effect at the interface of TMDCs and metal…
Metal organic chemical vapor deposition (MOCVD) is one of the main methodologies used for thin film fabrication in the semiconductor industry today and is considered one of the most promising routes to achieve large-scale and high-quality…
The interest in tellurium nanostructures is on the rise due to their outstanding physical properties including high carrier mobility, anisotropic charge conduction, photoconductivity, thermoelectricity, and piezoelectricity. Applications in…
In this review, we discuss the impact of interfaces and heterojuctions on the electronic and thermoelectric transport properties of materials. We review recent progress in understanding electronic transport in two-dimensional (2D) materials…
This work builds on the previous introduction [1] of a coupled experimental-computational system devised to fully characterize the thermal behavior of complex 3D submicron electronic devices. The new system replaces the laser-based surface…
In multilevel 3D integrated packaging, three major microstructures are viable due to the application of low volume of solders in different sizes, and/or processing conditions. Thermodynamics and kinetics of binary compounds in Cu/Sn/Cu low…
This paper reports the first study carried out by surface-enhanced Raman spectroscopy (SERS) during the galvanostatic electrodeposition (ECD) of copper from an acidic sulphate solution, in the presence of polyethylene glycol (PEG),…
Modern multi-core systems have a large number of design parameters, most of which are discrete-valued, and this number is likely to keep increasing as chip complexity rises. Further, the accurate evaluation of a potential design choice is…
Experimental insight into the elementary processes underlying charge transfer across interfaces has blossomed with the wide-spread availability of ultra-high vacuum set-ups that allow the preparation and characterization of solid surfaces…
The requirement for low operational voltage in electrowetting devices, met using thin dielectrics, is usually connected with serious material failure issues. Dielectric breakdown (visible as electrolysis) is frequently evident slightly…
Ferroelectric memories have attracted significant interest due to their non-volatile storage, energy efficiency, and fast operation, making them prime candidates for future memory technologies. As commercial Dynamic Random Access Memory…
Photopolymerization-based additive manufacturing enables cost-effective, high-speed fabrication of complex 3D structures but is constrained by a trade-off between resolution and printing speed. Single-photon polymerization ensures rapid…
Memory and network bandwidth are decisive bottlenecks when handling high-resolution multidimensional data sets in visualization applications, and they increasingly demand suitable data compression strategies. We introduce a novel lossy…
Additive manufacturing and 3D printing in particular have the potential to revolutionize existing fabrication processes where objects with complex structures and shapes can be built with multifunctional material systems. For electrochemical…