Related papers: Copper Electrodeposition for 3D Integration
Study of the dephasing in electronic systems is not only important for probing the nature of their ground states, but also crucial to harnessing the quantum coherence for information processing. In contrast to well-studied conventional…
To reconstruct a 3D scene from a set of calibrated views, traditional multi-view stereo techniques rely on two distinct stages: local depth maps computation and global depth maps fusion. Recent studies concentrate on deep neural…
Developing a packaging scheme that meets all of the requirements for operation of solid-state qubits in a cryogenic environment can be a formidable challenge. In this article, we discuss work being done in our group as well as in the…
The 2D/3D construction of hybrid perovskite interfaces is gaining increasing attention due to their enhanced stability towards degradation without compromising the corresponding solar cell efficiency. Much of it is due to the interfacial…
3D integration, i.e., stacking of integrated circuit layers using parallel or sequential processing is gaining rapid industry adoption with the slowdown of Moore's law scaling. 3D stacking promises potential gains in performance, power and…
Video depth estimation is essential for providing 3D scene structure in applications ranging from autonomous driving to mixed reality. Current end-to-end video depth models have established state-of-the-art performance. Although current…
Enhancing performance while reducing costs is the fundamental design philosophy of integrated circuits (ICs). With advancements in packaging technology, interposer-based chiplet architecture has emerged as a promising solution. Chiplet…
Van der Waals integration enables the creation of electronic and optoelectronic devices with unprecedented performance and novel functionalities beyond the existing material limitations. However, it is typically realized using a physical…
First-principles calculations of electron interactions in materials have seen rapid progress in recent years, with electron-phonon (e-ph) interactions being a prime example. However, these techniques use large matrices encoding the…
The field of two-dimensional (2D) materials has grown dramatically in the last two decades. 2D materials can be utilized for a variety of next-generation optoelectronic, spintronic, clean energy, and quantum computation applications. These…
The paper presents a strategy to construct an incremental Singular Value Decomposition (SVD) for time-evolving, spatially 3D discrete data sets. A low memory access procedure for reducing and deploying the snapshot data is presented.…
Two-dimensional (2D) materials are promising candidates for spintronic applications. Maintaining their atomically smooth interfaces during integration of ferromagnetic (FM) electrodes is crucial since conventional metal deposition tends to…
This paper reports on 3D-printed dielectric image lines for low-loss subTHz applications between 140 and 220 GHz. In contrast to conventional dielectric waveguides, a conductive copper substrate is used to achieve robust routing and…
This work demonstrates a large area process for atomically thin 2D semiconductors to unlock the technological upscale required for their commercial uptake. The new atomic layer deposition (ALD) and conversion technique yields large area…
Thermomechanical stress induced by through-silicon vias (TSVs) plays an important role in the performance and reliability analysis of 2.5D/3D ICs. While the finite element method (FEM) adopted by commercial software can provide accurate…
Depth completion is a vital task for autonomous driving, as it involves reconstructing the precise 3D geometry of a scene from sparse and noisy depth measurements. However, most existing methods either rely only on 2D depth representations…
To realize the creation of advanced multifunctional materials in energy storage and conversion technologies, the present research evaluates the structural, electronic, magnetic, thermodynamic, mechanical, thermoelectric, piezoelectric and…
Silicon Carbide (SiC) is an outstanding material, not only for electronic applications, but also for projected functionalities in the realm of photonic quantum technologies, nano-mechanical resonators and photonics on-a-chip. For shaping 3D…
Two-dimensional (2D) transition metal dichalcogenides (TMDCs), exemplified by molybdenum disulfide (MoS2), have shown exceptional potential for data-centred, energy-efficient electronic applications due to their unique electrical,…
As modern electronic devices are increasingly miniaturized and integrated, their performance relies more heavily on effective thermal management. Two-phase cooling methods enhanced by porous surfaces, which capitalize on thin-film…