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Mobile robots have disrupted the material handling industry which is witnessing radical changes. The requirement for enhanced automation across various industry segments often entails mobile robotic systems operating in logistics facilities…
It may be possible to reinvent how microelectronics are made using a two step process: (1) Synthesizing modular, nanometer-scale components -- transistors, sensors, and other devices -- and suspending them in a liquid "ink" for storage or…
A simple and fast process for micro-electromechanical (MEM) resonators with deep sub-micron transduction gaps in thin SOI is presented in this paper. Thin SOI wafers are important for advanced CMOS technology and thus are evaluated as…
Graphene is a promising candidate for future electronic applications. Manufacturing graphene-based electronic devices typically requires graphene transfer from its growth substrate to another desired substrate. This key step for device…
The doping of semiconductor materials is a fundamental part of modern technology, but the classical approaches have in many cases reached their limits both in regard to achievable charge carrier density, as well as mobility. Modulation…
A new class of hybrid systems that couple optical, electrical and mechanical degrees of freedom in nanoscale devices is under development in laboratories worldwide. These nano-opto-electro-mechanical systems (NOEMS) offer unprecedented…
Implantable Medical Devices (IMDs) such as pacemakers and neurostimulators are highly constrained in terms of energy. In addition, the wireless-communication facilities of these devices also impose security requirements considering their…
As a novel approach to flexibly adjust the wireless environment, reconfigurable intelligent surfaces (RIS) have shown significant application potential across various domains, including wireless communication, radar detection, and the…
Bond pads are the electrical interconnections of a microelectronic device to the outside world. A polyimide layer (PI) on top of a microelectronic device protects the whole device against environmental impacts. The bond pads are accessible…
We have developed a calibration system based on a micro-electromechanical systems (MEMS) mirror that is capable of delivering an optical beam over a wavelength range of 180 -- 2000 nm (0.62 -- 6.89 eV) in a sub-Kelvin environment. This…
We describe Simudo, a free Poisson/drift-diffusion steady state device model for semiconductor and intermediate band materials, including self-consistent optical absorption and generation. Simudo is the first freely available device model…
Microelectromechanical systems (MEMS) gyroscopes are widely used in consumer and automotive applications. They have to fulfill a vast number of product requirements which lead to complex mechanical designs of the resonating structure.…
A maskless post-processing technique for CMOS chips is developed that enables the fabrication of RF MEMS parallel-plate capacitors with a high quality factor and a very compact size. Simulations and measured results are presented for…
Fully harnessing the vast design space enabled by metamaterials to control electromagnetic (EM) fields remains an open problem for researchers. Inverse-design techniques have shown to best exploit the degrees of freedom available in design,…
A new Room Temperature (RT) 0-level vacuum package is demonstrated in this work, using amorphous silicon (aSi) as sacrificial layer and SiO2 as structural layer. The process is compatible with most of MEMS resonators and Resonant…
We propose to revisit the functional scaling paradigm by capitalizing on two recent developments in advanced chip manufacturing, namely 3D wafer bonding and backside processing. This approach leads to the proposal of the CMOS 2.0 platform.…
This study presents the design, fabrication, and test of a micro accelerometer with intrinsic processing capabilities, that integrates the functions of sensing and computing in the same MEMS. The device consists of an inertial mass…
The metrology field has been progressed with the appearance of the wireless intelligent sensor systems providing more capabilities such as signal processing, remote multi-sensing fusion etc. This kind of devices is rapidly making their way…
Microelectromechanical system (MEMS) based on-chip resonators offer great potential for sensing and high frequency signal processing applications due to their exceptional features like small size, large frequency-quality factor product,…
The semiconductor industry is one of the most technology-evolving and capital-intensive market sectors. Effective inspection and metrology are necessary to improve product yield, increase product quality and reduce costs. In recent years,…